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Metallizing technologies for organometallic liquids

Metallizing technologies for organometallic liquids
有机金属液体金属化技术
批准号:
493701-2016
负责人:
Mayer, Michael
金额:
$1.66万
依托单位:
依托单位国家:
加拿大
项目类别:
Collaborative Research and Development Grants
财政年份:
2018
资助国家:
加拿大
项目状态:
已结题
起止时间:
2018-01-01 至 2019-12-31

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中文摘要
翻译
**研究项目“有机金属液体的金属化技术”是与滑铁卢大学和Microbonds Inc.合作的,旨在开发将薄膜金属层应用于各种表面的新工艺。这些过程依赖于Microbonds新开发的有机金属液体。滑铁卢大学的研究项目分为三个子项目:液膜沉积和固化、表征和应用演示。****多达四名学生接受薄膜技术、电子封装技术、实验系统设计、专业沟通和项目执行以及分析工具方面的培训。通过与Microbonds的合作,他们将了解商业化问题、大规模生产要求和知识产权战略。这些技能为他们在微电子、微系统、物联网等领域的工作做好了准备。****预期的好处包括表面金属化的新知识和技术,这些知识和技术将转移到合作伙伴公司,获得专利并发表。由于从微键的有机金属液体中金属化的原子性质,期望更坚固可靠的金属化。在先进的微系统、电子、医疗设备、汽车、物联网(IoT)、可穿戴设备、功能织物和电子服装等领域,各种高质量和低成本的应用是可能的。与一些现有技术相比,新的金属化还具有将环境影响降至最低的潜力。**
英文摘要
**The research project "Metallizing Technologies for Organometallic Liquids" is a collaboration with the University of Waterloo and Microbonds Inc., Markham, ON, that aims at developing new processes to apply thin film metallic layers to a variety of surfaces. These processes depend on newly developed organometallic liquids from Microbonds. The research project at the University of Waterloo is divided in three subprojects: liquid film deposition and curing, characterization, and demonstrations of applications. ****Up to four students receive training on this project in thin film technology, electronic packaging techniques, experimental systems design, professional communication and project execution, and analytical tools. In collaboration with Microbonds, they will learn about commercialization issues, mass production requirements, and intellectual property strategies. These skills prepare them well for jobs in the fields of microelectronics, microsystems, internet-of-things, and others. ****The expected benefits include new knowledge and technology for surface metallizations which will be transferred to the partner company, patented, and published. Due to the atomistic nature of metallizations from Microbonds' organometallic liquids, more robust and reliable metallizations are expected. A variety of applications with increase quality and low cost are possible in fields such as advanced microsystems, electronics, medical devices, automotive, internet of things (IoT), wearables, functional fabrics, and electronic garments. The new metallizations also have the potential to minimize the environmental impact compared to some existing technologies. **
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Models for Initiation and Growth of Microwelds in Ultrasonic Bonding
  • 批准号:
    RGPIN-2018-04338
  • 项目类别:
    Discovery Grants Program - Individual
  • 资助金额:
    $4.08万
  • 财政年份:
    2022
  • 负责人:
    Mayer, Michael
  • 依托单位:
Models for Initiation and Growth of Microwelds in Ultrasonic Bonding
  • 批准号:
    RGPIN-2018-04338
  • 项目类别:
    Discovery Grants Program - Individual
  • 资助金额:
    $2.04万
  • 财政年份:
    2021
  • 负责人:
    Mayer, Michael
  • 依托单位:
Models for Initiation and Growth of Microwelds in Ultrasonic Bonding
  • 批准号:
    RGPIN-2018-04338
  • 项目类别:
    Discovery Grants Program - Individual
  • 资助金额:
    $2.04万
  • 财政年份:
    2020
  • 负责人:
    Mayer, Michael
  • 依托单位:
Models for Initiation and Growth of Microwelds in Ultrasonic Bonding
  • 批准号:
    RGPIN-2018-04338
  • 项目类别:
    Discovery Grants Program - Individual
  • 资助金额:
    $2.04万
  • 财政年份:
    2019
  • 负责人:
    Mayer, Michael
  • 依托单位:
海外基金