Integration technologies for immersion cooling in microelectronics

拟议中的项目是舍布鲁克大学(UdeS)、Systemex Energy Inc.和Varitron Technologies Inc.之间的研究合作，旨在为先进的电子设备开发一种新型的高效冷却技术。这种冷却技术的基础是将半导体器件浸入介电液体中，以受益于其汽化相变，从而有效地将热量从器件中带走。这种方法以前已经被研究过，在相对简单的实现中清楚地展示了它令人印象深刻的热性能。然而，由于两个技术问题，浸没冷却尚未充分发挥其潜力，这两个问题都与对浸没冷却所涉及的现象的科学理解不完全有关。第一个问题是所谓的沸腾危机，这是一种复杂的现象，涉及热量、液体和蒸汽的流动，限制了热性能，并造成了稳定性问题。第二个问题是，浸没未为此目的而设计的电子元件造成的可靠性风险，这些电子元件可能会因为浸没而受到新的故障机制的影响。在这里，我们建议从根本上研究沸腾危机和可靠性风险，开发能够被严格证明是高效、稳定和可靠的精密工程浸没硬件。该项目将使用先进的实验技术和模拟方法，以促进对沸腾冷却的科学理解。冷却技术将在C2MI的工业规模制造设备上进行开发和测试，因此可以在良好的集成封装过程中经济高效地生产，最终加快新技术向行业的转移。失效机制的动力学将通过实验进行测量，并将根据浸没的硬件中的化学相互作用和热机械现象进行解释。

The proposed project is a research collaboration between the Université de Sherbrooke (UdeS), Systemex Energy inc. and Varitron Technologies inc., to develop a new type of highly efficient cooling technology for advanced electronic devices. This cooling technology is based on immersing the semiconductor device into a dielectric liquid, to benefit from its vaporization phase change to carry heat away from the device efficiently. This approach has been studied before, in relatively simple implementations which clearly demonstrates its impressive thermal performances. However, immersion cooling has not yet reached its full potential because of two technological issues, both related to an incomplete scientific understanding of the phenomena involved in immersion cooling. The first issue is the so-called boiling crisis, a complex phenomenon involving the flux of heat, liquid and vapor which limits the thermal performances and create stability issues. The second issue is the reliability risk created by immersing electronic components which have not been designed for this purpose, and which might be subjected to new failure mechanisms because of immersion. Here, we propose to study at a fundamental level both the boiling crisis and the reliability risk, to develop precisely engineered immersion hardware which can be rigorously shown to be efficient, stable and reliable. The project will used advanced experimental techniques and simulation methods to contribute to the scientific understanding of cooling by boiling. The cooling technology will be developed and tested on industrial-scale manufacturing equipment at C2MI, so it can be produced cost-effectively in a well integrated packaging process, with an eventual expedited transfer of the new technology to the industry. The kinetics of failure mechanisms will be measured experimentally, and will be interpreted with respect to chemical interactions and thermomechanical phenomena in the immersed hardware.****