Development and Characterization of High Thermally Conductive Polymeric Composites

随着电子产品变得越来越小，功率越来越大，增强的散热对热管理材料来说变得越来越重要。此外，随着电子废物数量的增加，可持续塑料的使用受到越来越多的关注。因此，这表明需要开发新一代轻质、高导热和绝缘的可持续聚合物复合材料，以替代当前的热管理材料。在此背景下，拟建项目的目标是设计、制造和表征具有增强导热性的聚合物基复合材料。这项工作将产生适用的技术，不仅用于制造高导热复合材料，而且用于开发具有工程网络结构的复合材料，用于未来的应用，如传感器。

As electronics becoming smaller and more power full, enhanced heat dissipation is becoming more essential for heat management materials. Also, with increasing number of electronic wastes, use of sustainable plastics is receiving more attention. So, this suggests the need for development of the new generation of light in weight high thermally conductive and electrically insulative sustainable polymeric composites as a replacement for current heat management materials. Given this background, the objectives of the proposed project would be design, fabrication, and characterization of polymer based composite materials with enhanced thermal conductivity. This work will generate applicable techniques not only to the manufacturing of high thermally conductive composites but also to the development of composites with engineered network structure for future applications such as sensors.