Low Temperature Interconnections for High Performance Heterogeneous Integration

为了通过微型化继续提高性能、降低成本和增加普及性，下一代创新微电子必须依赖于将许多不同但高性能的功能和组件集成到紧凑但功能上级的系统中。 在许多情况下，最佳组件与要求温度超过250°C的传统焊接工艺不兼容。 选择具有足够耐温性的降低性能和/或更高成本的部件或接受温度敏感部件的劣化的替代方案都留下了机会。因此，本项目建议研究探索和实施低温互连材料，结构和工艺到微电子封装，从而消除高性能系统中成本敏感的微电子元件集成的障碍。 通过与工业合作伙伴和全球微电子领导者IBM加拿大合作，从这项研究中获得的解决方案将被优化开发，以实现具有成本效益和全球竞争力的微电子生产。 该项目还将通过减少能源消耗和改善零部件的再利用，为环保意识的制造做出贡献。

To continue to increase performance, reduce cost and increase ubiquity through miniaturization, the next generation of innovative microelectronics must rely on integrating many disparate but highly performing functions and components available today into compact yet functionally superior systems. In many cases, the optimal component is not compatible with traditional soldering processes that demand temperatures in excess of 250°C. The alternatives of selecting reduced performance and/or higher cost components with sufficient temperature resistance or accepting a degradation of the temperature sensitive component both leave opportunity on the table. This project therefore proposes research to explore and implement low temperature interconnection materials, structures and processes into microelectronic packaging and thus remove the barriers to the integration of cost sensitive microelectronic components in high performance systems. By collaborating with industrial partner and global leader in microelectronics, IBM Canada, the solutions derived from this research will be optimally developed for cost-effective, globally competitive microelectronics production. The project will also contribute to environmentally conscience manufacturing by reducing energy consumption and improving component re-use.