Atmospheric pressure spatial atomic layer deposition system

薄膜涂层是许多技术(所有现代电子产品、能量捕获和存储设备、光学元件、食品包装等)不可或缺的组成部分。随着特征尺寸持续减小(例如，在集成电路和存储器件中)，需要对涂层厚度和性能进行越来越好的控制。原子层沉积(ALD)是制备具有纳米级厚度控制的薄膜的最佳技术，因为它一次沉积一个原子层。与ALD相关的缺点包括它的速度(速度慢)和对真空室的需要，这阻碍了它在某些应用中的使用(例如，卷筒到卷筒制造和大面积涂层)。滑铁卢大学的研究人员开发了一种大气压空间原子层沉积工具。本发明可以在低温下沉积纳米级的涂层，比ALD快1-2个数量级，能够为商业应用的大基板镀膜。这些优势使UW发明对高产能制造非常有吸引力。在拟议的项目中，将对UW发明的性能进行基准测试(例如，运营成本、法规遵从性)。还将对涂层在有前景的应用(薄膜电池、光伏、抗菌涂层)中进行初步测试。计划中的测试版测试和应用程序测试的结果将有助于建立垂直目标市场(S)、可能的初创公司创建的时机以及上市战略。

Thin film coatings are integral components of many technologies (all modern electronics, energy capture and storage devices, optical components, food packaging, etc.). As feature sizes continue to decrease (e.g., in integrated circuits and memory devices), better and better control over the coating thickness and properties is needed. Atomic layer deposition (ALD) is the best technique for producing films with nanometer-scale thickness control, as it deposits a film one atomic layer at a time. Weaknesses associated with ALD include its speed (it is slow) and its need for a vacuum chamber, which hinders its use in some applications (e.g., roll-to-roll manufacturing and large-area coatings). Researchers at the University of Waterloo have developed an atmospheric pressure spatial atomic layer deposition tool. The invention can deposit nanoscale coatings at low temperatures, is 1-2 orders of magnitude faster than ALD, and is capable of coating large substrates for commercial applications. These advantages make the UW invention very attractive for high-throughput manufacturing. In the proposed project, the performance of the UW invention will be benchmarked (e.g., operating cost, compliance with regulations). Preliminary testing of the coatings in promising applications (thin-film batteries, photovoltaics, antimicrobial coatings) will also be performed. The results of the planned beta trials and application testing will help establish target market vertical(s), timing of a possible startup company's creation, and a go-to-market strategy.