A Multiple-Ring-Modulated JTE Technique for 4H-SiC Power Device With Improved JTE-Dose Window
A Multiple-Ring-Modulated JTE Technique for 4H-SiC Power Device With Improved JTE-Dose Window
复制标题
用于 4H-SiC 功率器件的多环调制 JTE 技术,具有改进的 JTE 剂量窗口
DOI:
10.1109/ted.2017.2761995
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发表时间:
2017-12
影响因子:
3.1
通讯作者:
Zhang Bo
中科院分区:
文献类型:
--
作者:
Deng Xiaochuan;Li Lijun;Wu Jia;Li Chengzhan;Chen Wanjun;Li Juntao;Li Zhaoji;Zhang Bo
In this paper, a multiple-ring-modulated junction termination extension (MRM-JTE) technology for large-area silicon carbide PiN rectifier rated at 4500 V is proposed and experimentally investigated using a standard two-zone JTE (TZ-JTE) process without extra process steps or masks. Multiple modulation rings embedded inside JTE region, which is similar to varied lateral doping technology widely used in silicon devices, form a gradual decrease of effective charges in the termination region. MRM combines the advantages of two termination techniques, namely, ring-assisted JTE and space-modulated JTE, to enlarge the optimum JTE-dose window with high reverse blocking voltage in comparison with conventional TZ-JTE. A breakdown voltage of 4940 V at a leakage current of <inline-formula> <tex-math notation="LaTeX">$1~\mu \text{A}$ </tex-math></inline-formula> is achieved from fabricated MRM-JTE rectifiers with a 36-<inline-formula> <tex-math notation="LaTeX">$\mu \text{m}$ </tex-math></inline-formula>-thick N<sup>−</sup> epilayer doped to <inline-formula> <tex-math notation="LaTeX">${1.8} \times {10}^{{15}}$ </tex-math></inline-formula> cm<sup>−3</sup>, which is 92% of the ideal parallel-plane value. A forward current of 50 A has been measured at a forward voltage drop of 3.9 V for devices with an active anode area of 9.2 mm<sup>2</sup>, corresponding to low differential on-resistance of 1.8 <inline-formula> <tex-math notation="LaTeX">$\text{m}\Omega \cdot \text {cm}^{ {2}}$ </tex-math></inline-formula>. The simulation and experimental results show that the proposed device exhibits approximately 2 times JTE dose tolerance window improvement with respect to the breakdown voltage of 4500 V.
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影响因子:
4.9
作者:
Yang, Shuai;Tang, Guannan;Zhang, Yimen;Zhang, Yuming
通讯作者:
Zhang, Yuming
影响因子:
4.9
作者:
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通讯作者:
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影响因子:
3.1
作者:
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通讯作者:
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影响因子:
3.1
作者:
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通讯作者:
Huang, Alex Q.
影响因子:
4.9
作者:
Chowdhury, Sauvik;Hitchcock, Collin;Chow, T. Paul
通讯作者:
Chow, T. Paul