Improved Interfacial and Electrical Properties of Ge-Based Metal-Oxide-Semiconductor Capacitor With LaTaON Passivation Layer

Improved Interfacial and Electrical Properties of Ge-Based Metal-Oxide-Semiconductor Capacitor With LaTaON Passivation Layer
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具有 LaTaON 钝化层的 Ge 基金属氧化物半导体电容器的界面和电性能得到改善

DOI:
10.1109/ted.2014.2356597
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发表时间:
2014-09
影响因子:
3.1
通讯作者:
Lai, P. T.
Lai, P. T.
中科院分区:
工程技术2区
文献类型:
--
作者:
Xu, Jing-Ping;Huang, Yong;Liu, Lu;Lai, P. T.

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研究了以HfTiO为高k栅介质、LaTaON为钝化层的Ge基金属氧化物半导体(MOS)电容器的界面特性和电学特性。实验结果表明,采用HfTiO/LaTaON栅叠层介质的Ge MOS具有低的界面态密度(7.8 ×<sup>1011</sup> cm<sup>-2</sup> eV<sup>-1</sup>)、小的栅漏电流(7.88 × 10<sup>-</sup> 4Acm<sup>-2</sup>(<sub>Vg-Vfb</sub>= 1V))、小的电容等效厚度(1.1nm)和大的等效介电常数(27.7).<sub></sub>X射线光电子能谱(XPS)和透射电子显微镜(TEM)分析表明,这种改善是由于La/Ta基氧化物/氮氧化物与Ge具有良好的界面特性,LaTaON中间层能有效地阻挡氧的内扩散和锗的外扩散,从而抑制了低k GeOx的生长和Ge与Hf的互混.<sub></sub>
The interfacial and electrical properties of Ge-based metal-oxide-semiconductor (MOS) capacitor with high-k gate dielectric of HfTiO and passivation interlayer of LaTaON are investigated. Experimental results show the Ge MOS with HfTiO/LaTaON gate-stacked dielectric exhibits low interface-state density (7.8 × 10<sup>11</sup> cm<sup>-2</sup> eV<sup>-1</sup>), small gate-leakage current (7.88 × 10<sup>-4</sup> A cm<sup>-2</sup> at V<sub>g</sub> - V<sub>fb</sub> = 1 V), small capacitance equivalent thickness (1.1 nm), and large equivalent dielectric constant (27.7). X-ray photoelectron spectroscopy and transmission electron microscopy reveal that the improvements should be due to the fact that La/Ta-based oxide/oxynitride has excellent interface properties with Ge, and the LaTaON interlayer can effectively block the in-diffusion of oxygen and the out-diffusion of germanium, thus suppressing the growth of low-k GeO<sub>x</sub> and intermixing between Ge and Hf.
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