A Novel Packaged Ultra-High Q Silicon MEMS Butterfly Vibratory Gyroscope.
A Novel Packaged Ultra-High Q Silicon MEMS Butterfly Vibratory Gyroscope.
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DOI：
10.3390/mi13111967
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发表时间：
2022-11-13
期刊：
影响因子：
3.4
通讯作者：
Han W
中科院分区：
文献类型：
--
作者：
Jia L;Han G;Wei Z;Si C;Ning J;Yang F;Han W
将一种新颖的三维(3D)晶圆级夹层封装技术应用于双质量MEMS蝶式振动陀螺(BFVG)中，以实现超高Q因子。采用玻璃回流技术加工了以玻璃为主体、低阻硅柱为垂直引线的GIS(Glass In Silicon)复合基板，有效地避免了热应力失配造成的漏气。玻璃帽上使用了溅射吸气剂材料，进一步提高了真空度。绝缘体上硅(SOI)陀螺结构夹在复合基板和玻璃帽之间，通过高真空阳极键合实现垂直电互连。用自行研制的双闭环路系统测量的BFVG的驱动和传感模式的Q值分别比传统陶瓷外壳封装的Q值提高了8.628倍和2.779倍。加工后的陀螺的分辨率为0.10°/S，刻度因数为1.302 mV/(°/S)，在±1800°/S的满刻度范围内，非线性系数为558ppm。通过计算艾伦方差，得到了1.281°/√h的角随机游动和9.789°/h的低偏置不稳定性。加工误差使陀螺的实际驱动频率和传感频率与模拟结果相比偏差了8.989%和5.367%。
A novel three-dimensional (3D) wafer-level sandwich packaging technology is here applied in the dual mass MEMS butterfly vibratory gyroscope (BFVG) to achieve ultra-high Q factor. A GIS (glass in silicon) composite substrate with glass as the main body and low-resistance silicon column as the vertical lead is processed by glass reflow technology, which effectively avoids air leakage caused by thermal stress mismatch. Sputter getter material is used on the glass cap to further improve the vacuum degree. The Silicon-On-Insulator (SOI) gyroscope structure is sandwiched between the composite substrate and glass cap to realize vertical electrical interconnection by high-vacuum anodic bonding. The Q factors of drive and sense modes in BFVG measured by the self-developed double closed-loop circuit system are significantly improved to 8.628 times and 2.779 times higher than those of the traditional ceramic shell package. The experimental results of the processed gyroscope also demonstrate a high resolution of 0.1°/s, the scale factor of 1.302 mV/(°/s), and nonlinearity of 558 ppm in the full-scale range of ±1800°/s. By calculating the Allen variance, we obtained the angular random walk (ARW) of 1.281°/√h and low bias instability (BI) of 9.789°/h. The process error makes the actual drive and sense frequency of the gyroscope deviate by 8.989% and 5.367% compared with the simulation.
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DOI：
10.3390/s21196428
发表时间：
2021-09-26
期刊：
Sensors (Basel, Switzerland)
影响因子：
--
作者：
Xu P;Si C;He Y;Wei Z;Jia L;Han G;Ning J;Yang F
通讯作者：
Yang F
DOI：
10.1088/0960-1317/14/11/014
发表时间：
2004-11-01
影响因子：
2.3
作者：
Jeong, C;Seok, S;Chun, K
通讯作者：
Chun, K
影响因子：
3.4
作者：
Xu P;Wei Z;Guo Z;Jia L;Han G;Si C;Ning J;Yang F
通讯作者：
Yang F
影响因子：
4.6
作者：
Hou, Zhanqiang;Kuang, Yunbin;Wu, Xuezhong
通讯作者：
Wu, Xuezhong
影响因子：
1.6
作者：
Xiao, Dingbang;Cao, Shijie;Wu, Xuezhong
通讯作者：
Wu, Xuezhong