Three-dimensional placement rules of Cu6Sn5 textures formed on the (111)Cu and (001)Cu surfaces using electron backscattered diffraction
Three-dimensional placement rules of Cu6Sn5 textures formed on the (111)Cu and (001)Cu surfaces using electron backscattered diffraction
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使用电子背散射衍射在 (111)Cu 和 (001)Cu 表面上形成的 Cu6Sn5 织构的三维排列规则
DOI：
10.1016/j.matdes.2016.01.037
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发表时间：
2016-03
影响因子：
8.4
通讯作者：
Shihua Yang
中科院分区：
文献类型：
--
作者：
Mingyu Li;Yuxi Yu;Haifeng Yang;Shihua Yang
研究了液态Sn 0. 7 Cu中Cu 6Sn 5织构的晶粒取向和表面特征，|（111）Cu和液态Sn0.7Cu|用电子背散射衍射技术对（001）Cu接头界面进行了系统的研究。结果表明，（111）Cu和（001）Cu表面上强Cu 6Sn 5织构的形成主要有两个原因：（1）Cu 6Sn 5和Cu相在面内正交方向上的低但非最小的晶格匹配;（2）Cu 6Sn 5相的轴向生长行为。基于这些原因，我们提出并验证了两种类型的Cu 6Sn 5织构的三维布局规则，以揭示Cu 6Sn 5在Cu表面上的形核行为。此外，还测试了实际接头界面上Cu 6Sn 5织构的宏观剪切强度。该研究有助于阐明Cu 6Sn 5相在（111）Cu和（001）Cu表面的外延生长机制，为三维集成电路互连应用中Cu 6Sn 5相的取向设计提供有力的科学依据。
In this work, the grain orientations and surface characteristics of Cu6Sn5 textures formed at the liquid-Sn0.7Cu |(111)Cuand liquid-Sn0.7Cu |(001)Cujoint interfaces were systematically investigated using the electron backscattered diffraction technique. The results showed that there were two dominant reasons for formation of the strong Cu6Sn5 textures on the (111)Cuand (001)Cusurfaces: (1) the low but not minimum lattice matches of Cu atoms between Cu6Sn5 and Cu phases in the in-plane orthogonal directions and (2) the axial growth behaviour of Cu6Sn5 phase. Based on these reasons, we proposed and verified two types of the three-dimensional placement rules of Cu6Sn5 textures to reveal the nucleation behaviour of Cu6Sn5 on Cu surfaces. In addition, the macroscopic shear strengths of Cu6Sn5 textures on the actual joint interfaces were also tested. Our study may help clarify the epitaxial growth mechanism of Cu6Sn5 phase on the (111)Cuand (001)Cu surfaces and provide a strong scientific basis of Cu6Sn5 orientation design for three-dimensional integrated circuit interconnect applications.
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