Influence of Emitter Side Design on the Unintentional Turn-on of 10kV+ SiC n-IGBTs
Influence of Emitter Side Design on the Unintentional Turn-on of 10kV+ SiC n-IGBTs
复制标题
发射极侧设计对 10kV SiC n-IGBT 意外开通的影响
DOI:
10.1109/ecce50734.2022.9947492
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发表时间:
2022
期刊:
影响因子:
--
通讯作者:
Almpanis I
中科院分区:
文献类型:
--
作者:
Almpanis I
Silicon Carbide (SiC) N-channel Insulated Gate Bipolar Transistors (n-IGBTs) rated higher than 10kV can improve Medium Voltage and High Voltage power electronics due to the favourable combination of SiC material with the n-IGBT device structure. This paper investigates the phenomenon of unintentional turn-on occurring due to high dV/dt produced during switching transients and analyses the impact of design parameters such as the channel length, the p-well doping and the oxide thickness for their ability to suppress it.
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