Influence of Emitter Side Design on the Unintentional Turn-on of 10kV+ SiC n-IGBTs

Influence of Emitter Side Design on the Unintentional Turn-on of 10kV+ SiC n-IGBTs
复制标题

发射极侧设计对 10kV SiC n-IGBT 意外开通的影响

DOI:
10.1109/ecce50734.2022.9947492
复制
发表时间:
2022
期刊:
--
影响因子:
--
通讯作者:
Almpanis I
Almpanis I
中科院分区:
--
文献类型:
--
作者:
Almpanis I

文献摘要

参考文献

被引文献

相似文献

额定电压高于10kV的碳化硅(SiC)N沟道绝缘栅双极型晶体管(n-IGBT)由于碳化硅材料与n-IGBT器件结构的良好结合,可以改善中压和高压电力电子设备。本文研究了由于开关瞬变过程中产生的高dV/dt而产生的非故意导通现象,并分析了沟道长度、p势垒掺杂和氧化层厚度等设计参数对其抑制能力的影响。
Silicon Carbide (SiC) N-channel Insulated Gate Bipolar Transistors (n-IGBTs) rated higher than 10kV can improve Medium Voltage and High Voltage power electronics due to the favourable combination of SiC material with the n-IGBT device structure. This paper investigates the phenomenon of unintentional turn-on occurring due to high dV/dt produced during switching transients and analyses the impact of design parameters such as the channel length, the p-well doping and the oxide thickness for their ability to suppress it.
具有优化逆行 p 阱的超高压 4H-SiC IGBT 的鲁棒性
DOI: 10.1109/demped.2019.8864804
发表时间: 2019
期刊: 2019 IEEE 12th International Symposium on Diagnostics for Electrical Machines, Power Electronics and Drives (SDEMPED)
影响因子: --
作者:
Amit K. Tiwari;S. Perkin;N. Lophitis;Marina Antoniou;T. Trajkovic;F. Udrea
通讯作者: F. Udrea
DOI: 10.1109/jestpe.2020.2989805
发表时间: 2021
影响因子: 5.5
作者:
A. Stratta;B. Mouawad;M. Antonini;L. de Lillo;L. Empringham;Mark C. Johnson
通讯作者: Mark C. Johnson
用于更高密度 CMOS 的逆行 p 阱
DOI: 10.1109/t-ed.1981.20498
发表时间: 1981
影响因子: 3.1
作者:
R. Rung;C. Dell'Oca;L. Walker
通讯作者: L. Walker
DOI: 10.1109/iit.1998.813837
发表时间: 1998
期刊: 1998 International Conference on Ion Implantation Technology. Proceedings (Cat. No.98EX144)
影响因子: --
作者:
Y. Jang;T. Huh;J. Ro
通讯作者: J. Ro
15 kV SiC n-IGBT 的特性及其在大功率转换器中的应用注意事项
DOI: 10.1109/ecce.2013.6647027
发表时间: 2013
期刊: 2013 IEEE Energy Conversion Congress and Exposition
影响因子: --
作者:
A. Kadavelugu;S. Bhattacharya;S. Ryu;E. van Brunt;D. Grider;A. Agarwal;S. Leslie
通讯作者: S. Leslie