Rapid, General-Purpose Patterning of Silicon Nitride Thin Films Under Ambient Conditions for Applications Including Fluid Channel and SERS Substrate Formation
Rapid, General-Purpose Patterning of Silicon Nitride Thin Films Under Ambient Conditions for Applications Including Fluid Channel and SERS Substrate Formation
复制标题
在环境条件下对氮化硅薄膜进行快速通用图案化,适用于流体通道和 SERS 基板形成等应用
DOI:
10.1021/acsanm.0c00248
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发表时间:
2020
影响因子:
5.9
通讯作者:
Dwyer, Jason R.
中科院分区:
文献类型:
--
作者:
Sheetz, Brian S.;Bandara, Y.M. Nuwan;Rickson, Benjamin;Auten, Michael;Dwyer, Jason R.
Silicon nitride thin films are useful as etch-stop masks in micro- and nanofabrication. As structural elements, they are prevalent in applications as diverse as single-molecule sensing, transmission electron microscopy, ultrafast spectroscopy, superfluidity studies, and high flux liquid filtering. A hand-held “flameless” Tesla-coil lighter was used to create vias through 200 nm silicon nitride (SiNx) films coating silicon wafers. The processing allowed spatially directed KOH etching of the underlying Si. Patterning could be achieved with a hard mask or rastering of the spatially confined discharge, offering—with low barriers to rapid use—particular capabilities that might otherwise be out of reach to researchers without access to conventional, instrumentation-intensive micro- and nanofabrication workflows. General patterning capabilities were demonstrated, followed by the formation of a trench suitable for microfluidic applications. Finally, a discharge-treated thin film surface was sputter coated with gold to create a surface enhanced Raman spectroscopy (SERS) substrate that was then used to detect a test analyte at ppm concentration.
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影响因子:
9.5
作者:
Y. N. D. Bandara;B. Karawdeniya;Julie C. Whelan;Lucas D S Ginsberg;Jason R Dwyer
通讯作者:
Jason R Dwyer
DOI:
10.1146/annurev.anchem.1.031207.112814
发表时间:
2008-01-01
影响因子:
8
作者:
Stiles, Paul. L.;Dieringer, Jon A.;Van Duyne, Richard R.
通讯作者:
Van Duyne, Richard R.
DOI:
10.1021/la0635653
发表时间:
2007
期刊:
Langmuir : the ACS journal of surfaces and colloids
影响因子:
--
作者:
R. Stine;C. L. Cole;K. Ainslie;S. Mulvaney;L. Whitman
通讯作者:
L. Whitman
影响因子:
5.9
作者:
Karawdeniya, Buddini Iroshika;Bandara, Y. M. Nuwan D. Y.;Dwyer, Jason R.
通讯作者:
Dwyer, Jason R.
影响因子:
16.6
作者:
Karawdeniya BI;Bandara YMNDY;Nichols JW;Chevalier RB;Dwyer JR
通讯作者:
Dwyer JR