Compatibility of HfN Metal Gate Electrodes With Hf0.5Zr0.5O2 Ferroelectric Thin Films for Ferroelectric Field-Effect Transistors

Compatibility of HfN Metal Gate Electrodes With Hf0.5Zr0.5O2 Ferroelectric Thin Films for Ferroelectric Field-Effect Transistors
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HfN金属栅电极与铁电场效应晶体管Hf0.5Zr0.5O2铁电薄膜的兼容性

DOI:
10.1109/led.2018.2868275
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发表时间:
2018-09
影响因子:
4.9
通讯作者:
Yichun Zhou
Yichun Zhou
中科院分区:
工程技术2区
文献类型:
--
作者:
Binjian Zeng;Wenwu Xiao;Jiajia Liao;Heng Liu;Min Liao;Qiangxiang Peng;Shuaizhi Zheng;Yichun Zhou

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研究了Hf0.5Zr0.5O2(HZO)铁电薄膜与氮化铪(HfN)电极在铁电场效应晶体管(FeFET)中的相容性。结果发现,HZO薄膜覆盖的HfN顶部电极提供了改善的铁电性能和较低的漏电流密度相比,HZO薄膜覆盖的TiN顶部电极。此外,具有HfN/HZO(10 nm)/SiO2栅堆叠的FeFET显示出100 ns的快速写入速度,0.92 V的大的10年外推存储器窗口(MW),以及104个编程/擦除周期后0.5 V的中等MW。这封信代表了第一次尝试制造高性能的FeFET存储器件与完全基于铌的栅极堆叠。
Compatibility of hafnium nitride (HfN) electrodes with Hf0.5Zr0.5O2 (HZO) ferroelectric thin films was investigated for ferroelectric field-effect transistor (FeFET) applications. It was found that HZO thin films capped by HfN top electrodes offer improved ferroelectric properties and lower leakage current densities compared to HZO thin films capped by TiN top electrodes. Moreover, FeFETs with HfN/HZO (10 nm)/SiO2 gate-stacks showed a fast write speed of 100 ns, a large 10-year extrapolated memory window (MW) of 0.92 V, and a moderate MW of 0.5 V after 104 program/erase cycles. This letter represents a first attempt to fabricate high-performance FeFET memory devices with a fully hafnium-based gate-stack.
DOI: 10.1109/vlsit.2016.7573414
发表时间: 2016-06
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