Double-layer stepped Si(1 0 0) surfaces prepared in As-rich CVD ambience
Double-layer stepped Si(1 0 0) surfaces prepared in As-rich CVD ambience
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富As CVD环境下制备双层阶梯式Si(1′0′0)表面
DOI:
10.1016/j.apsusc.2018.07.181
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发表时间:
2018
影响因子:
6.7
通讯作者:
T. Hannappel
中科院分区:
文献类型:
--
作者:
A. Paszuk;O. Supplie;M. Nandy;S. Brückner;A. Dobrich;P. Kleinschmidt;B. Kim;Y. Nakano;M. Sugiyama;T. Hannappel
Low-defect III-V integration on Si(1 0 0) requires atomically well-ordered heterointerfaces. To this end, we study the interaction of As with Si(1 0 0) surfaces and the formation of dimerized Si(1 0 0):As surfacesin situwith reflection anisotropy spectroscopy during metalorganic chemical vapor deposition (MOCVD). Control of surface processes allows us to intentionally ‘rotate’ the dimer orientation and choose between predominantly (1 × 2) and (2 × 1) reconstructed Si(1 0 0):As surfaces both for low and higher surface misorientation. We also verify that the (2 × 1) surface reconstruction becomes energetically more favorable for vicinal Si(1 0 0):As surfaces. We explain the preparation of Si(1 0 0):As surfaces displaying an almost single-domain, (1 × 2) reconstructed surface with an RMS roughness ≤1 Å and exhibiting broad, atomically flat terraces as well as regular double-layer steps. This surface is highly suitable for subsequent low-defect III-V integration.
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影响因子:
1.6
作者:
T. Hannappel;S. Visbeck;L. Töben;F. Willig
通讯作者:
F. Willig
DOI:
--
发表时间:
2015
期刊:
影响因子:
--
作者:
Y. P. Wang;J. Stodolna;M. Bahri;Jithesh Kuyyalil;T. N. Thanh;S. Almosni;R. Bernard;R. Tremblay;M. F. Silva;A. Létoublon;T. Rohel;K. Tavernier;L. Largeau;G. Patriarche;A. Corre;A. Ponchet;C. Magén;C. Cornet;O. Durand
通讯作者:
O. Durand
DOI:
--
发表时间:
1995
期刊:
影响因子:
--
作者:
F. Rochet;C. Poncey;G. Dufour;H. Roulet;W. Rodrigues;M. Sauvage;J. Boulliard;F. Sirotti;G. Panaccione
通讯作者:
G. Panaccione
DOI:
10.1002/pssb.201700493
发表时间:
2018
期刊:
physica status solidi (b)
影响因子:
--
作者:
S. Brückner;O. Supplie;A. Dobrich;P. Kleinschmidt;T. Hannappel
通讯作者:
T. Hannappel
影响因子:
9.5
作者:
O. Supplie;M. May;C. Höhn;H. Stange;A. Müller;P. Kleinschmidt;S. Brückner;T. Hannappel
通讯作者:
T. Hannappel