Bimorph material/structure designs for high sensitivity flexible surface acoustic wave temperature sensors.

Bimorph material/structure designs for high sensitivity flexible surface acoustic wave temperature sensors.
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高灵敏度柔性表面声波温度传感器的双压电晶片材料/结构设计

DOI:
10.1038/s41598-018-27324-1
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发表时间:
2018-06-13
期刊:
影响因子:
4.6
通讯作者:
Fu YQ
Fu YQ
中科院分区:
综合性期刊3区
文献类型:
--
作者:
Tao R;Hasan SA;Wang HZ;Zhou J;Luo JT;McHale G;Gibson D;Canyelles-Pericas P;Cooke MD;Wood D;Liu Y;Wu Q;Ng WP;Franke T;Fu YQ

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声表面波(SAW)温度传感器的一个基本挑战是检测非平面(通常是弯曲的)表面上的微小温度变化。在这项工作中,我们提出了一种新的基于柔性衬底和双压片材料/结构的SAW器件设计方法,该方法可以最大化频率温度系数(TCF)。对厚度为1~1600 μm的氧化锌薄膜(~5 μm)涂覆铝(Al)箔和铝板衬底的声表面波传感器进行了有限元模拟,得到了理论TCF值,并在此基础上制作了具有不同厚度的声表面波器件。实验测得的TCF值与模拟结果吻合较好。采用归一化波长参数(波长与样品厚度之比,λ/h)成功地描述了TCF值的变化,当归一化波长λ/h大于1时,器件的TCF值显著增加。采用这种设计方法,我们获得了报道的最高的−760 ppm/K,对于由氧化锌薄膜覆盖在铝箔(50 μm厚)上的SAW器件,从而使低成本的温度传感器应用于柔性衬底上。
A fundamental challenge for surface acoustic wave (SAW) temperature sensors is the detection of small temperature changes on non-planar, often curved, surfaces. In this work, we present a new design methodology for SAW devices based on flexible substrate and bimorph material/structures, which can maximize the temperature coefficient of frequency (TCF). We performed finite element analysis simulations and obtained theoretical TCF values for SAW sensors made of ZnO thin films (~5 μm thick) coated aluminum (Al) foil and Al plate substrates with thicknesses varied from 1 to 1600 μm. Based on the simulation results, SAW devices with selected Al foil or plate thicknesses were fabricated. The experimentally measured TCF values were in excellent agreements with the simulation results. A normalized wavelength parameter (e.g., the ratio between wavelength and sample thickness, λ/h) was applied to successfully describe changes in the TCF values, and the TCF readings of the ZnO/Al SAW devices showed dramatic increases when the normalized wavelength λ/h was larger than 1. Using this design approach, we obtained the highest reported TCF value of −760 ppm/K for a SAW device made of ZnO thin film coated on Al foils (50 μm thick), thereby enabling low cost temperature sensor applications to be realized on flexible substrates.
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