Development of phase shift lithography for the production of metal-oxide-metal diodes

Development of phase shift lithography for the production of metal-oxide-metal diodes
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开发用于生产金属氧化物金属二极管的相移光刻技术

DOI:
10.1049/mnl.2014.0102
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发表时间:
2014
影响因子:
1.3
通讯作者:
Dodd L
Dodd L
中科院分区:
材料科学4区
文献类型:
--
作者:
Dodd L

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金属-氧化物-金属(Metal‐Oxide‐ Metal,简称MOSFET)二极管是通过结合两种新技术生产的:反应离子蚀刻和随后的等离子体氧化,以及相移光刻工艺。这使得器件的特征尺寸显著减小,降至亚微米尺寸,相关二极管的零电压曲率系数提高至2.8 V− 1。考虑到在高速整流应用中使用MOSFET二极管,二极管面积的减小以及受控的氧化物生长的组合旨在帮助提高器件的截止频率,从而确保高速应用的潜力。
Metal‐oxide‐metal (MOM) diodes have been produced by combining two novel techniques: a reactive ion etche and subsequent plasma oxidation, and a phase shift lithography process. This has resulted in a significant reduction in device feature sizes, down to sub‐micron dimensions and with an improved zero voltage curvature coefficient of up to 2.8 V−1for the associated diodes. Given the use of MOM diodes in high speed rectification applications, the combination of the reduction in diode area as well as the controlled oxide growth aims to assist in the improved cutoff frequency of the devices, thus ensuring the potential for high speed applications.
通过简单氧化技术制造的 Ti-TiOx-Pt 金属氧化物金属二极管
DOI: 10.1557/opl.2012.72
发表时间: 2012
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影响因子: --
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