A resonant pressure microsensor capable of self-temperature compensation.
A resonant pressure microsensor capable of self-temperature compensation.
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一种具有自温度补偿功能的谐振压力微传感器
DOI：
10.3390/s150510048
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发表时间：
2015-04-29
期刊：
影响因子：
--
通讯作者：
Chen J
中科院分区：
文献类型：
--
作者：
Li Y;Wang J;Luo Z;Chen D;Chen J
谐振式微型压力传感器以其准数字输出和长期稳定的优点被广泛应用于航空航天探测和大气压力监测等领域，但这需要使用额外的温度传感器进行温度补偿。本文提出了一种谐振式压力微传感器，它具有自温度补偿的功能，不需要额外的温度传感器。在压力膜片上设置了两个双固位的H型谐振梁，作为响应压力变化的差动输出。通过对一组不同压力和温度下的固有谐振频率进行标定，得到了以两个谐振频率为输入，以被测温度和压力为输出的函数，较好地解决了温度变化对谐振频率漂移的干扰。在补偿前，测量压力值的最大误差超过1.5%，而在补偿后，误差小于全压力量程的0.01%（温度范围为−40 °C至70 °C，压力范围为50 kPa至110 kPa）。
Resonant pressure microsensors are widely used in the fields of aerospace exploration and atmospheric pressure monitoring due to their advantages of quasi-digital output and long-term stability, which, however, requires the use of additional temperature sensors for temperature compensation. This paper presents a resonant pressure microsensor capable of self-temperature compensation without the need for additional temperature sensors. Two doubly-clamped “H” type resonant beams were arranged on the pressure diaphragm, which functions as a differential output in response to pressure changes. Based on calibration of a group of intrinsic resonant frequencies at different pressure and temperature values, the functions with inputs of two resonant frequencies and outputs of temperature and pressure under measurement were obtained and thus the disturbance of temperature variations on resonant frequency shifts was properly addressed. Before compensation, the maximal errors of the measured pressure values were over 1.5% while after compensation, the errors were less than 0.01% of the full pressure scale (temperature range of −40 °C to 70 °C and pressure range of 50 kPa to 110 kPa).
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影响因子：
4.6
作者：
Kasten, K;Amelung, J;Mokwa, W
通讯作者：
Mokwa, W
DOI：
10.1049/ip-d.1988.0056
发表时间：
1988-09-01
期刊：
IEE PROCEEDINGS-D CONTROL THEORY AND APPLICATIONS
影响因子：
--
作者：
GREENWOOD, JC;SATCHELL, DW
通讯作者：
SATCHELL, DW
影响因子：
1.6
作者：
Pramanik, C;Islam, T;Saha, H
通讯作者：
Saha, H
基于晶圆级 MEMS 真空封装的具有穿玻璃电气互连的高 Q 谐振压力微传感器
DOI：
10.3390/s141224244
发表时间：
2014-12-16
期刊：
Sensors (Basel, Switzerland)
影响因子：
--
作者：
Luo Z;Chen D;Wang J;Li Y;Chen J
通讯作者：
Chen J
影响因子：
4.6
作者：
GREENWOOD, J;WRAY, T
通讯作者：
WRAY, T