Source/Drain Engineered Charge-Plasma Junctionless Transistor for the Immune of Line Edge Roughness Effect
Source/Drain Engineered Charge-Plasma Junctionless Transistor for the Immune of Line Edge Roughness Effect
复制标题
源极/漏极工程电荷等离子体无结晶体管,可免受线边缘粗糙度影响
DOI:
10.1109/ted.2018.2812241
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发表时间:
2018-05
影响因子:
3.1
通讯作者:
Xinnan Lin
中科院分区:
文献类型:
--
作者:
Wenbo Wan;Haijun Lou;Ying Xiao;Xinnan Lin
In this paper, the charge-plasma structure over the source/drain region is incorporated into a dopingless junctionless transistor for obtaining the superior immunity of line edge roughness (LER). An optimized on/off current ratio is observed by using numerical simulations. It is also demonstrated that the proposed charge-plasma junctionless transistor (CP-JLT) is insensitive to the variation of LER magnitude. We further reveal the physics that LER affects the electrical characteristics of CP-JLT. Channel minimal width position variation and channel width variation are put forward to explore the impact of LER for the first time. It is observed that the LER affects the <inline-formula> <tex-math notation="LaTeX">${I}_{\text {ON}}$ </tex-math></inline-formula> of CP-JLT due to the changes of the source width caused by channel minimal width position variation, whereas the LER affects the <inline-formula> <tex-math notation="LaTeX">${I}_{\text {OFF}}$ </tex-math></inline-formula>, SS, and <inline-formula> <tex-math notation="LaTeX">${V}_{\text {th}}$ </tex-math></inline-formula> mainly through channel width variation. It is thus proved to be a helpful guide to suppress the LER variation of CP-JLT.
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影响因子:
1.7
作者:
Colinge, J. P.;Kranti, A.;Razavi, P.
通讯作者:
Razavi, P.
影响因子:
4.9
作者:
Sahu, Chitrakant;Singh, Jawar
通讯作者:
Singh, Jawar
影响因子:
3.1
作者:
Chitrakant Sahu;Jawar Singh
通讯作者:
Chitrakant Sahu;Jawar Singh
影响因子:
1.7
作者:
Lee, Chi-Woo;Ferain, Isabelle;Colinge, Jean-Pierre
通讯作者:
Colinge, Jean-Pierre
DOI:
10.1109/iedm.2014.7047158
发表时间:
2014-12
期刊:
2014 IEEE International Electron Devices Meeting
影响因子:
--
作者:
Y. Lee;Ta-Chun Cho;K. Kao;P. Sung;F. Hsueh;P. Huang;C. Wu;Shu‐Han Hsu;W. Huang;H. Chen;Y. Li;M. Current;B. Hengstebeck;J. Marino;T. Buyuklimanli;J. Shieh;T. Chao;W. Wu;W. Yeh
通讯作者:
Y. Lee;Ta-Chun Cho;K. Kao;P. Sung;F. Hsueh;P. Huang;C. Wu;Shu‐Han Hsu;W. Huang;H. Chen;Y. Li;M. Current;B. Hengstebeck;J. Marino;T. Buyuklimanli;J. Shieh;T. Chao;W. Wu;W. Yeh