Understanding Vmin Failures for Improved Testing of Timing Marginalities
Understanding Vmin Failures for Improved Testing of Timing Marginalities
复制标题
了解 Vmin 故障以改进时序裕度测试
DOI:
10.1109/itc50671.2022.00046
复制
发表时间:
2022
期刊:
影响因子:
--
通讯作者:
Singh, Adit D.
中科院分区:
文献类型:
--
作者:
Singh, Adit D.
There has been speculation that the source of many of the unpredictable and hard to diagnose intermittent errors being increasingly observed in operation are timing marginalities, accentuated in low voltage operation, that escape detection during test. To investigate this possibility, we present a comprehensive study, combining analytical modeling with simulation, of the impact of random process variations on the timing of CMOS gates and circuit paths when operating at significantly reduced voltages. Our analysis is validated with the help of production test data recently published by a large industrial team for an advanced FinFET technology [1]. A key, somewhat unexpected, observation from this study is that virtually all variability paths that are statistical outliers, slow enough to cause timing failure, contain a single extremely weak transistor which contributes a large share of the increased delay. This suggests that TDF timing tests, that target localized “lumped” delay defects, may also detect many timing failures caused by distributed delays from process variations. The perceived need for path delay testing to target such failures is at least partially mitigated. We further show how the results of the analysis in this paper can be leveraged for conditioning the voltage and timing of the applied TDF scan tests to help enhance detection of such marginal timing parts, thereby reducing test escapes and minimizing system level tests.
登录
查看更多内容
DOI:
10.1109/ats49688.2020.9301557
发表时间:
2020
期刊:
2020 IEEE Asian Test Symposium
影响因子:
--
作者:
Polian, Ilia;Anders, Jens;Becker, Steffen;Bernardi, Paolo;Chakrabarty, Krishnendu;ElHamawy, Nourhan;Sauer, Matthias;Singh, Adit;Reorda, Matteo Sonza;Wagner, Stefan
通讯作者:
Wagner, Stefan
DOI:
10.1109/itc44170.2019.9000173
发表时间:
2019
期刊:
2019 IEEE International Test Conference (ITC
影响因子:
--
作者:
Singh, Adit D.
通讯作者:
Singh, Adit D.
DOI:
10.1109/iemtronics51293.2020.9216418
发表时间:
2020
期刊:
2020 IEEE International IOT, Electronics and Mechatronics Conference (IEMTRONICS)
影响因子:
--
作者:
M. Anees;K. Rahul;Sourabh Aditya Swarnkar;Santosh Yachareni
通讯作者:
Santosh Yachareni
DOI:
10.1109/test.2012.6401533
发表时间:
2012
期刊:
2012 IEEE International Test Conference
影响因子:
--
作者:
F. Hapke;Michael Reese;J. Rivers;A. Over;V. Ravikumar;W. Redemund;Andreas Glowatz;J. Schlöffel;J. Rajski
通讯作者:
J. Rajski
DOI:
--
发表时间:
2005
期刊:
IEEE International Conference on Test, 2005.
影响因子:
--
作者:
J. Rearick;R. Rodgers
通讯作者:
R. Rodgers