Influence of base resistance on extracting thermal resistance for SiGe HBTs
Influence of base resistance on extracting thermal resistance for SiGe HBTs
复制标题
基极电阻对 SiGe HBT 提取热阻的影响
DOI:
10.1002/mmce.20606
复制
发表时间:
2012-05
影响因子:
1.7
通讯作者:
高建军
中科院分区:
文献类型:
--
作者:
T. Zhou;X. Xu;P. Li;高建军
In this article, the influence of base resistance on extracting thermal resistance for SiGe heterojunction bipolar transistors is studied and an improved approach for determining the junction temperature and thermal resistance is presented. The proposed method for extracting thermal resistance is based on the temperature sensitivity of the base–emitter (B–E) voltage when the device is biased with a fixed emitter current density. This approach not only takes into account the self‐heating during the different ambient temperature measurement but also revises the empirical equation of B–E voltage due to the influence of base resistance during the power dissipation increment measurement. Results are obtained for devices with different emitter lengths and fingers. Compared with the conventional method, the thermal resistance is about up to 15% improvement for the device with 0.3 × 1.9 μm2 emitter area and 13.8% for the device with 0.3 × 13.9 μm2 emitter area. The accurate thermal resistance implemented in HICUM model has resulted in better fit for transistor output characteristics. © 2012 Wiley Periodicals, Inc. Int J RF and Microwave CAE, 2012.
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DOI:
10.1109/smic.2001.942350
发表时间:
2001-09
期刊:
2001 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems. Digest of Papers (IEEE Cat. No.01EX496)
影响因子:
--
作者:
J. Rieh;D. Greenberg;Basanth Jagannathan;G. Freeman;S. Subbanna
通讯作者:
J. Rieh;D. Greenberg;Basanth Jagannathan;G. Freeman;S. Subbanna
影响因子:
8.3
作者:
R. V. D. Toorn;W. Kloosterman
通讯作者:
R. V. D. Toorn;W. Kloosterman
影响因子:
3.6
作者:
J. McMacken;S. Nedeljkovic;J. Gering;D. Halchin
通讯作者:
J. McMacken;S. Nedeljkovic;J. Gering;D. Halchin
DOI:
10.1109/bipol.2002.1042895
发表时间:
2002-12
期刊:
Proceedings of the Bipolar/BiCMOS Circuits and Technology Meeting
影响因子:
--
作者:
H. Mnif;T. Zimmer;J. Battaglia;B. Ardouin
通讯作者:
H. Mnif;T. Zimmer;J. Battaglia;B. Ardouin
影响因子:
3.1
作者:
N. Bovolon;P. Baureis;J. Muller;P. Zwicknagl;R. Schultheis;E. Zanoni
通讯作者:
N. Bovolon;P. Baureis;J. Muller;P. Zwicknagl;R. Schultheis;E. Zanoni