A Simple Method for the Measurement of Young's Moduli of Bilayer Thin Films Based on the Electrostatic Drive Approach.
A Simple Method for the Measurement of Young's Moduli of Bilayer Thin Films Based on the Electrostatic Drive Approach.
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DOI：
10.3390/mi13111943
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发表时间：
2022-11-10
期刊：
影响因子：
3.4
通讯作者：
Wang, Lei
中科院分区：
文献类型：
--
作者：
Liu, Haiyun;Zhang, Zhen;Gao, Hongmin;Zhang, Lili;Wang, Lei
本文提出了一种简单的表面微机械双层薄膜杨氏模量的原位测量方法。测试结构由悬臂、位于锚附近的底部驱动电极和位于悬臂自由端下方的底部接触电极组成。通过在悬臂和驱动电极之间施加电压扫描来驱动悬臂，并且悬臂由于静电力而弯曲。一种新的理论模型推导出与所施加的电压和结构尺寸的杨氏模量。通过有限元仿真验证了理论模型的正确性。利用PolyMUMPs制作了Au/多晶硅薄膜测试结构，并利用电流-电压测量系统进行了测试。测量的多晶硅的杨氏模量范围为152.344 GPa至154.752 GPa，并且测量的Au的杨氏模量范围为71.794 GPa至74.880 GPa。与现有的提取方法相比，该方法操作简单，重复性好，精密度较高，对设备要求较低。它可以与表面微加工工艺线中的工艺控制监控器（PCM）一起使用。
This paper presents a simple method for the in situ determination of Young’s moduli of surface-micromachined bilayer thin films. The test structure consists of a cantilever, a bottom drive electrode located near the anchor, and a bottom contact electrode placed below the free end of the cantilever. The cantilever is driven by applying a voltage sweep between the cantilever and the drive electrode, and bends due to the electrostatic force. A novel theoretical model is derived to relate Young’s modulus with the applied voltage and structure dimensions. The theoretical model is validated by finite element simulation. Test structures for Au/polysilicon thin films are fabricated by the PolyMUMPsand tested with the current–voltage measurement system. The measured Young modulus of polysilicon ranges from 152.344 GPa to 154.752 GPa, and the measured Young modulus of Au ranges from 71.794 GPa to 74.880 GPa. Compared with existing extraction methods, the proposed method is featured with simple operation, good repeatability, relatively high precision, and low requirements for equipment. It can be used alongside the application of a process control monitor (PCM) in surface-micromachining process lines.
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影响因子：
3.4
作者：
Sapienza S;Ferri M;Belsito L;Marini D;Zielinski M;La Via F;Roncaglia A
通讯作者：
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影响因子：
4.6
作者：
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通讯作者：
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影响因子：
2.3
作者：
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通讯作者：
Wee, DM
影响因子：
4.6
作者：
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通讯作者：
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影响因子：
4.6
作者：
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通讯作者：
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