Self-cleaning mechanisms in ultrasonic bonding of Al wire
Self-cleaning mechanisms in ultrasonic bonding of Al wire
复制标题
铝线超声键合中的自清洁机制
DOI：
10.1016/j.jmatprotec.2018.03.016
复制
发表时间：
2018
影响因子：
6.3
通讯作者：
Twiefel
中科院分区：
文献类型：
--
作者：
Dencker;Hermsdorf;Twiefel
实时观察的人工增加的氧化层在超声（US）键合过程中进行，以揭示自清洁机制。在法向力加载后，在Al 2 O3层中发生裂纹，裂纹位于丝/基界面的周边区域，且垂直于丝方向。当US振动开始时，氧化物开始从纯金属表面分离并向接触区域的中间移动。随着进一步的振动周期，这些分离的氧化物从薄片研磨成小颗粒。由于三种机制，包括渗透，氧化物流动和推动，小的氧化物颗粒被传输到周边接触区域或接触区域的外部。当金属飞溅存在时，促进了大量氧化物的流出。预变形产生裂纹;振动在分离、研磨、渗透和氧化物流动中起重要作用;而塑性变形引起的材料流动对于通过推动从衬底去除氧化物更关键。剪切试验表明，50 nm的氧化物涂层可显著提高Al-玻璃结合强度2 ~ 3倍。
Real-time observations of the artificially increased oxide layer during the ultrasonic (US) bonding process were carried out to reveal the self-cleaning mechanisms. After the normal force loading, cracks occurred in the Al2O3layer at the peripheral region of the wire/substrate interface and were perpendicular to the wire direction. As the US vibration started, the oxides started to detach from the pure metal surface and moved towards the middle of the contact area. With further vibration cycles, these detached oxides were milled from flakes into small particles. Due to three mechanisms including penetration, oxide flow and pushing, the small oxide particles were transported to the peripheral contact region or the outside of the contact area. When a metal splash existed, the flowing out of large amounts of oxides was facilitated. Pre-deformation originates cracks; vibration plays a significant role in detachment, milling, penetration and oxide flow; while the plastic deformation induced material flow is more critical on removing the oxides from the substrate by pushing. The shear tests showed that a 50 nm oxide coating could significantly enhance the Al-glass bonding strength by 2∼3 times.
登录
查看更多内容
DOI：
--
发表时间：
2017
期刊：
CPMT Symposium Japan
影响因子：
--
作者：
Y. Long;F. Dencker;Andreas Isaak;Chun Li;M. Wurz;J. Twiefel;J. Wallaschek;F. Schneider;J. Hermsdorf
通讯作者：
J. Hermsdorf
超声波焊接粗铝线与铝合金焊盘之间的界面微观结构
DOI：
--
发表时间：
2013
期刊：
影响因子：
--
作者：
Masakatsu Maeda;S. Kitamori;Y. Takahashi
通讯作者：
Y. Takahashi
通过金属-玻璃接合揭示超声波引线接合机制
DOI：
10.1016/j.mseb.2018.11.010
发表时间：
2018
期刊：
Materials Science and Engineering: B
影响因子：
--
作者：
Dencker;Schneider;Hermsdorf;Twiefel;Wallaschek
通讯作者：
Wallaschek
超声波楔-楔键合过程中氧化物去除机理的研究
DOI：
10.1109/eptc.2016.7861512
发表时间：
2016
期刊：
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC)
影响因子：
--
作者：
Y. Long;F. Dencker;F. Schneider;B. Emde;Chun Li;J. Hermsdorf;M. Wurz;J. Twiefel
通讯作者：
J. Twiefel
更深入地了解超声波楔-楔键合过程中导线的运动行为
DOI：
10.4071/isom-2016-tha31
发表时间：
2016
期刊：
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)
影响因子：
--
作者：
Y. Long;F. Dencker;M. Wurz;A. Feldhoff;J. Twiefel
通讯作者：
J. Twiefel