FAW: Micro-Automation of Mechanical Processes

这项研究将处理两个基本问题。第一个话题是微观尺度上的摩擦。在研究静电微马达的同时，人们还尝试用蚀刻在硅中的结构来表征固态设备中的静摩擦。这个装置相当聪明，结果为微观尺度上的摩擦提供了新的见解，但它的应用仅限于测定半导体材料的静态摩擦系数。使用与已有的类似的磁力驱动的机器，这项工作可以扩展到各种材料的静态和动态摩擦系数的实验测定。第二个基本话题是小规模债券收益率强度。几乎所有的微电子设备都是通过连接到器件外围的引线连接到封装上的，但人们对这些连接的机械行为知之甚少。将开发一个粘结应力/应变信息数据库，该信息将用于开发粘结行为的预测模型。初步工作表明，结合中任何空洞的大小应该能够根据力/位移信息确定。这项基础研究将有助于确定真正无损的粘接应力水平，并最终开发出一种用于所有微型电子和机电产品制造的无损粘接质量监控机。

The research will deal with two basic issues. The first topic is friction on microscopic scales. In conjunction with the work on electrostatic micro-motors, there has been an attempt made to characterize static friction in solid state devices using a structure etched into silicon. This device is quite clever, and results are providing new insight into friction on microscopic scales, but its application is limited to determination of static friction coefficients for materials used on semiconductors. Using magnetically driven machines similar to those already being worked with, the work can be extended to experimental determination of static and dynamic friction coefficients of various materials. The second basic topic is small scale bond yield strengths. Virtually all microelectronic devices are connected to packages via leads bonded to the periphery of the device, yet little is known about the mechanical behavior of these bonds. A database of bond stress/strain information is to be developed and the information will be used to develop a predictive model of bond behavior. Preliminary work suggests that the size of any voids in the bond should be able to be determined from force/displacement information. This fundamental research will help determine levels of bond stress that are truly nondestructive, and should ultimately permit the development of a nondestructive bond quality monitoring machine for use in the manufacture of all miniature electronic and electromechanical items.