Investigation of TAB Lead-to-Chip Bonds

该提案涉及(1)分析模型和(2)实验室原型的开发，用于以非演绎方式评估胶带自动粘合（TAB）键合。考虑的参数是键合压力、温度和测试时间，这些对半导体电子工业很重要。该提案描述了将这些宏观参数与键的预测和可测量质量联系起来的研究，特别是键的机械强度，也许最终是可靠性。* * *

9412933 Busch-Vishniac The proposal addresses (1) analytical models and (2) the development of a laboratory prototype for the evaluation of Tape Automated Bonding (TAB) bonds in a non-deductive manner. The parameters considered are bonding pressure, temperature and testing duration which are important to the semiconductor electronics industry. The proposal describes research to relate these macroscopic parameters to the predicted and measurable quality of the bond, particularly the mechanical strength of the bond and, perhaps, eventually the reliability. ***