Active 3D Packaging Architecture

主动 3D 封装架构

• 批准号: 9161045
• 负责人: John Carson
• 金额: $ 4.99万
• 依托单位: Irvine Sensors Corporation
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1992
• 资助国家: 美国
• 起止时间: 1992-01-01 至 1992-09-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9161045&HistoricalAwards=false
• 关键词: Active; 3D; Packaging; Architecture

This research is concerned with investigating the use of a 3D packaging architecture along with memory and an active substrate to achieve low-power low-weight mass storage for use in laptop and notebook computers. The effort combines high density 3D packaging of conventional, domestically available SRAM devices with active mounting substrates that control the device power dissipation in the standby mode. A 50-megabyte hard disk replacement will consume .5 cubic inch and have negligible impact on battery run-down time. In addition, access time will reduce from milliseconds to less than 100 nanoseconds. This research effort will analytically verify the concept feasibility, design test articles, and develop an experimental test plan.

这项研究涉及调查使用3D 具有存储器和有源衬底的封装结构沿着 以实现用于笔记本电脑的低功耗、低重量的大容量存储， 笔记本电脑。 这项工作结合了高密度3D封装 传统的，国内可用的SRAM器件， 控制器件功耗的安装基板， 待机模式。 一个50兆字节的硬盘更换将消耗 .5立方英寸，并且对电池耗尽时间的影响可以忽略不计。 此外，访问时间将从毫秒减少到不到 100纳秒 这项研究工作将分析验证 概念可行性，设计测试文章，并开发一个 实验测试计划