Active 3D Packaging Architecture

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This research is concerned with investigating the use of a 3D packaging architecture along with memory and an active substrate to achieve low-power low-weight mass storage for use in laptop and notebook computers. The effort combines high density 3D packaging of conventional, domestically available SRAM devices with active mounting substrates that control the device power dissipation in the standby mode. A 50-megabyte hard disk replacement will consume .5 cubic inch and have negligible impact on battery run-down time. In addition, access time will reduce from milliseconds to less than 100 nanoseconds. This research effort will analytically verify the concept feasibility, design test articles, and develop an experimental test plan.