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Active 3D Packaging Architecture

Active 3D Packaging Architecture
主动 3D 封装架构
批准号:
9301913
负责人:
John Carson
金额:
$30.0万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
1993
资助国家:
美国
项目状态:
已结题
起止时间:
1993-07-15 至 1995-12-31

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中文摘要
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英文摘要
Laptop and notebook computers are two examples of the many applications that require low-power, low-volume mass storage. A prior SBIR Phase I research grant examined the feasibility of replacing hard disk drives with 3D packaged solid state memory. Specifically, this effort verified that a two inch by three inch by one-fifth inch PCMCIA type 2 memory card can provide 256 megabytes of memory with less than one microsecond access time and negligible power consumption. This capability can be provided cost effectively both as a standard hard drive and as main memory. This Phase II project develops and demonstrates a laboratory prototype of a 256 megabyte memory card that includes the active components required for data formatting, input-output drivers, and control logic, such that the memory card can be interfaced directly to existing laptop and notebook computers.
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Doctoral Dissertation Research:Testing Technologies in the Behavioral Sciences
Doctoral Dissertation Research: Global Population, Population Science, and Population Politics in the Twentieth Century
NSF-NATO Postdoctoral Fellow
  • 批准号:
    9255298
  • 项目类别:
    Fellowship Award
  • 资助金额:
    $3.54万
  • 财政年份:
    1993
  • 负责人:
    John Carson
  • 依托单位:
Active 3D Packaging Architecture
  • 批准号:
    9161045
  • 项目类别:
    Standard Grant
  • 资助金额:
    $4.99万
  • 财政年份:
    1992
  • 负责人:
    John Carson
  • 依托单位:
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