Small Grants for Exploratory Research: Helical Drill Point Grinder

这项工作是探索在印刷电路板制造业中使用的微钻头的孔质量和钻头寿命的改进，通过在钻头上使用螺旋点而不是目前使用的平面点。提出了一种描述微钻螺旋点的新几何模型。在此模型的基础上，设计并制造了一种用于微钻螺旋点磨削的运动机构。螺旋尖微钻的可用性对于探索理论上可行的性能和寿命的改进至关重要。这种可行性是基于这样一个事实，即与平面尖钻相比，螺旋尖钻沿钻头刃口提供了更高的间隙角分布，而不会削弱刃口。这种努力只涉及微型钻，结合印刷电路板行业的大量美元，它对电子行业的战略重要性，使得这是一个高风险的冒险，具有巨大的潜在回报。

This effort is to explore the improvements in hole quality and drill life of micro-drills used in the printed circuit board manufacturing industry, by the utilization of helical points on the drills rather than planar points that are currently utilized. A new geometrical model that describes a helical point on a micro -drill will be developed. Based on this model a kinematic mechanism will be designed and fabricated to grind helical points on micro-drills. The availability of helically-pointed micro-drills is essential to explore improvements in performance and life that appear to be theoretically feasible. This feasibility is based on the fact that helical points offer a much higher clearance angle distribution along the drill's cutting edge, without weakening the edge, in comparison to planar pointed drills. This effort that deals only with micro-drills in combination with the large dollar volume of the printed circuit board industry and it's strategic importance to the electronic industry, makes this a high risk venture with a significant potential for large pay-offs.