Technology and Curriculum Development for Packaging Optoelectronic Parallel Computing Systems Based on Free-Space Optical Interconnects

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This award, of $390,000, is for the development of optoelectronic packaging science technology and related curriculum. This is a joint effort between the Electrical and Computer Engineering Department at the University of California, San Diego and the Mechanical Engineering Department at the University of Colorado at Boulder. The joint effort will address the alignment, assembly, and CAD issues of packaging optoelectronic parallel computing systems, using leverage from the existing strengths of both institutions. The two complementary research efforts -- in a critical area driving U.S. economic competitiveness -- will be integrated into an educational program by means of curriculum development. Existing courses will be modified and new courses will be added to expedite transferring new research results to the classrooms.