Advanced Novolak Resins for Electronic Applications

微光化学公司计划进行合成 研究计划，以探索一种新的合成和制造 开发高级酚醛清漆树脂的方法 微电子、印刷电路板和LCD应用。 更 准确地说，是对科学设计的酚醛清漆树脂的评估， 具有上级的性能和再现性，特别是 适用于正性光致抗蚀剂的方法。 这些树脂将基于最近发表的关于 酚醛清漆树脂之间的氢键相互作用， 抗蚀剂的光敏组分。 他们还将 旨在提供更高的溶解速率，改善热性能， 稳定性、更好的批间重现性和极低的 金属离子污染 我们计划进行一项实验计划， 合成方法，制备离散低MW低聚组分， 并将这些低聚物转化成一系列嵌段共聚物 对树脂的相关性能进行评价。 MCC将携带 制定了一个可以导致固体酚醛清漆发展的计划， 金属离子含量低于100 ppb且批次间大于10%的树脂 再现性，并且其能够提供抗蚀剂， 分辨率优于0.5 μ m，阈值约为100 mJ/cm 2 能量和至少130 ℃的热稳定性。

Microlithography Chemical Company plans to conduct a synthetic research program to explore a new synthetic and manufacturing approach for the development of advanced novolak resins for microelectronic, printed circuit board, and LCD applications. More precisely, an evaluation of scientifically designed novolak resins with superior properties and reproducibility, specifically applicable for use in positive photoresists will be undertaken. These resins would be designed based on recently published work on the hydrogen bonding interactions between novolaks and photosensitive components of the resist. They would also be designed to give higher dissolution rates, improved thermal stability, better batch-to-batch reproducibility, and very low metal ion contamination. We plan to undertake an experimental program and develop a new synthetic approach, prepare discrete low MW oligomeric components, and to convert these oligomers into a series of block copolymer resins to be evaluated for relevant performance. MCC will carry out a program which could lead to the development of solid novolak resins with less than 100 ppb metal ion and > 10% batch-to-batch reproducibility, and which are capable of providing resists with better than 0.5 >m resolution, approximately 100 mJ/cm2 threshold energy, and at least 130>C thermal stability.