GOALI/IUCRP: Applying Acoustic Microcavitation to Semiconductor Processing

[500462]本研究旨在推进超声波清洁半导体芯片和器件的技术。目前的研究建立在先前的“超声诱导纳米尺度下的流体-颗粒相互作用”研究的基础上，该研究发现了“声诱导”，即通过高频强声场和弱声场的叠加，可以在液体微颗粒上诱导微空化。通过声诱导降低微空化所需的阈值，结合微流，提出了一种清洁半导体的方法。通过提高对声诱导微空化的基本认识，预计将确定关键的工艺控制参数，以实现实际的制造工艺。这项研究的另一个好处是有望开发一种检测超清洁液体的液体颗粒的新方法。随着半导体行业朝着使用越来越精细的细节在芯片上封装越来越多的信息的方向发展，制造技术的障碍变成了清洁状态。这个项目的成功完成可以导致基于知识的过程控制的超声波设备的建立，具有实现半导体超清洁制造环境的潜力。事实上，有两家小公司正在与这位研究人员合作，以这项有前途的技术为基础，开发检测液体微颗粒的仪器。

9500462 Madanshetty This research aims at advancing the technology of cleaning semiconductor chips and devices by ultrasonics. The current research builds on prior research on "Ultrasonically Induced Fluid-Particle Interactions at Nanometer Length Scales", which led to the discovery of "acoustic coaxing", whereby microcavitation can be induced on liquid borne microparticles by superposition of a strong acoustic field with a weak field at a very high frequency. By lowering the threshold needed for microcavitation via acoustic coaxing and combining with micro-streaming, a process to clean semiconductor is proposed. By advancing the fundamental understanding of acoustic coaxing induced microcavitation, it is expected that key process control parameters will be identified to realize a practical manufacturing process. An additional benefit of the research is expected in developing a new way of detecting liquid borne particles for ultra clean liquids. As the semiconductor industry drives towards packing of more and more information on a chip using finer and finer details, the barrier to manufacturing technology becomes the state of cleanliness. Successful completion of this project can lead to building of ultrasonic equipment with a knowledge based process control that has the potential of achieving ultra clean manufacturing environment for semiconductor. In fact, two small companies are partnering with this researcher based on this promising technology to develop instrumentation for detecting liquid borne microparticles.