GOALI/IUCRP: Applying Acoustic Microcavitation to Semiconductor Processing

9500462 Madanshetty这项研究旨在推进超声波清洗半导体芯片和设备的技术。目前的研究建立在先前对“纳米长度尺度下的超声诱导的流体-颗粒相互作用”的研究基础上，该研究导致了“声诱导”的发现，由此可以通过在非常高的频率下叠加强声场与弱场来在液体传播的微粒上诱导微空化。提出了一种利用声诱导降低微空化阈值，并结合微射流技术清洗半导体器件的方法。通过推进声诱导微空化的基本理解，预计将确定关键的工艺控制参数，以实现实际的制造过程。这项研究的另一个好处是开发一种新的方法来检测超净液体中的液体颗粒。随着半导体行业朝着使用越来越精细的细节在芯片上封装越来越多的信息的方向发展，制造技术的障碍变成了清洁度。该项目的成功完成可以导致超声波设备的建设与知识为基础的过程控制，有可能实现超洁净的半导体制造环境。事实上，两家小公司正在与这位研究人员合作，基于这项有前途的技术开发用于检测液体传播微粒的仪器。

9500462 Madanshetty This research aims at advancing the technology of cleaning semiconductor chips and devices by ultrasonics. The current research builds on prior research on "Ultrasonically Induced Fluid-Particle Interactions at Nanometer Length Scales", which led to the discovery of "acoustic coaxing", whereby microcavitation can be induced on liquid borne microparticles by superposition of a strong acoustic field with a weak field at a very high frequency. By lowering the threshold needed for microcavitation via acoustic coaxing and combining with micro-streaming, a process to clean semiconductor is proposed. By advancing the fundamental understanding of acoustic coaxing induced microcavitation, it is expected that key process control parameters will be identified to realize a practical manufacturing process. An additional benefit of the research is expected in developing a new way of detecting liquid borne particles for ultra clean liquids. As the semiconductor industry drives towards packing of more and more information on a chip using finer and finer details, the barrier to manufacturing technology becomes the state of cleanliness. Successful completion of this project can lead to building of ultrasonic equipment with a knowledge based process control that has the potential of achieving ultra clean manufacturing environment for semiconductor. In fact, two small companies are partnering with this researcher based on this promising technology to develop instrumentation for detecting liquid borne microparticles.