GOALI/IUCRP: Applying Acoustic Microcavitation to Semiconductor Processing

9500462马丹谢蒂这项研究旨在推进超声波清洗半导体芯片和器件的技术。目前的研究是建立在以前的“超声诱导纳米尺度的流体-颗粒相互作用”研究的基础上的，该研究导致了“声学诱导”的发现，即通过在很高的频率上叠加一个强声场和一个弱场来在液体中的微粒上诱发微空化。通过声学诱导降低微空化所需的阈值，并结合微流技术，提出了一种清洗半导体的工艺。通过提高对声诱导微空化的基本认识，有望识别关键的过程控制参数，以实现实际的制造过程。预计这项研究的另一个好处是开发一种新的方法来检测超清洁液体的液体颗粒。随着半导体行业朝着使用越来越精细的细节在芯片上封装越来越多的信息的方向发展，制造技术的障碍变成了清洁状态。该项目的成功完成将有助于建立具有基于知识的过程控制的超声波设备，该设备具有实现半导体超清洁制造环境的潜力。事实上，两家小公司正在与这位基于这项前景光明的技术的研究人员合作，开发用于检测液体微颗粒的仪器。

9500462 Madanshetty This research aims at advancing the technology of cleaning semiconductor chips and devices by ultrasonics. The current research builds on prior research on "Ultrasonically Induced Fluid-Particle Interactions at Nanometer Length Scales", which led to the discovery of "acoustic coaxing", whereby microcavitation can be induced on liquid borne microparticles by superposition of a strong acoustic field with a weak field at a very high frequency. By lowering the threshold needed for microcavitation via acoustic coaxing and combining with micro-streaming, a process to clean semiconductor is proposed. By advancing the fundamental understanding of acoustic coaxing induced microcavitation, it is expected that key process control parameters will be identified to realize a practical manufacturing process. An additional benefit of the research is expected in developing a new way of detecting liquid borne particles for ultra clean liquids. As the semiconductor industry drives towards packing of more and more information on a chip using finer and finer details, the barrier to manufacturing technology becomes the state of cleanliness. Successful completion of this project can lead to building of ultrasonic equipment with a knowledge based process control that has the potential of achieving ultra clean manufacturing environment for semiconductor. In fact, two small companies are partnering with this researcher based on this promising technology to develop instrumentation for detecting liquid borne microparticles.