Modeling of Interconnections for High-Speed Digital, Microwave and Optoelectronics Applications

高速数字、微波和光电应用的互连建模

• 批准号: 9520964
• 负责人: Jose Schutt-Aine
• 金额: $ 6万
• 依托单位: University of Illinois at Urbana-Champaign
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1996
• 资助国家: 美国
• 起止时间: 1996-03-01 至 1998-05-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9520964&HistoricalAwards=false
• 关键词: Modeling; Interconnections; Speed; Digital; Microwave

9520964 Schutt-Aine The electrical performance of high-speed integrated circuit and digital networks strongly depends on the electromagnetic performance of interconnects between components of a system. In recent years, packaging has become a critical area in the design of high-speed communications systems and fast computers. The purpose of this research is to provide the technology necessary to design aggressive packaging schemes in the areas of design, modeling, testing, measurement and circuit simulation. This objective will be achieved using electromagnetic theory as an analysis tool to yield a better understanding of interconnect problems. The implementation of computer-aided design tools for this simulation of packages and interconnects will be achieved. New design ideas will be studied and evaluated and solutions will be proposed for current system level integration problems. The complete effort is aimed at facilitating the task of circuit designers and reducing cost and time associated with the testing and evaluation of a given interconnect scheme. ***

9520964 Schutt-Aine高速集成电路和数字网络的电气性能在很大程度上取决于系统组件之间互连的电磁性能。 近年来，封装已成为高速通信系统和快速计算机设计的关键领域。 本研究的目的是提供必要的技术，设计积极的封装方案的设计，建模，测试，测量和电路仿真等领域。 这一目标将通过使用电磁理论作为分析工具来实现，以更好地理解互连问题。 计算机辅助设计工具的实施，这种模拟封装和互连将实现。 将研究和评估新的设计思想，并针对当前系统级集成问题提出解决方案。 完整的努力是为了方便电路设计人员的任务，并减少成本和时间与给定的互连方案的测试和评估。 ***