Low-cost Fully Monolithic RF Integrated Circuits for Wireless Applications

适用于无线应用的低成本全单片射频集成电路

• 批准号: 9979292
• 负责人: Jose Schutt-Aine
• 金额: $ 20万
• 依托单位: University of Illinois at Urbana-Champaign
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1999
• 资助国家: 美国
• 起止时间: 1999-10-01 至 2002-05-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9979292&HistoricalAwards=false
• 关键词: Low; cost; Fully; Monolithic; RF

9979292Schutt-Aine, JoseRadio frequency integrated circuits will strongly influence the versatility and portability of fu-ture wireless communication systems. With the ever increasing demands for higher bandwidth and capacity and for reductions in size, weight and cost, the need for more robust and efficient RF cir-cuits is expected to increase. In spite of recent advances in wireless circuit technology, several bar-riers still remain to be overcome before the next generation Low-cost portable systems can be im-plemented. These barriers require in-depth investigations in areas of design, modeling, simulation, processing, fabrication and testing. In this collaborative effort, we propose to integrate resources in these areas in order to implement a state-of-the art scheme for the design of future wireless RFICs. This effort will take advantage of recent developments in the processing of micro-electro-mechanical (MEM) devices as well as other technologies in microwave circuit design and process-ing. This integration combined with robust design guidelines and a low-cost packaging scheme will represent a substantial step towards the next generation communication system.IMPORTANT NOTE: This proposal is a joint effort between the University of Illinois at Urbana-Champalgn and the Georgia Institute of Technology and is being submitted by both institu-tions.***

射频集成电路将极大地影响未来无线通信系统的通用性和便携性。随着对更高带宽和容量以及对减小尺寸、重量和成本的不断增长的需求，预期对更鲁棒和更高效的RF电路的需求将增加。尽管无线电路技术最近取得了进展，但在实现下一代低成本便携式系统之前，仍有几个障碍有待克服。这些障碍需要在设计、建模、仿真、加工、制造和测试领域进行深入研究。在这种合作努力中，我们建议整合这些领域的资源，以实现一个国家的最先进的方案，为未来的无线RFIC的设计。这项工作将利用微电子机械（MEM）器件加工以及微波电路设计和加工中的其他技术的最新发展。这种集成与稳健的设计准则和低成本的封装方案相结合，将代表下一代通信系统迈出了实质性的一步。重要说明：本提案是伊利诺伊大学厄巴纳-香槟分校和格鲁吉亚理工学院的共同努力，并由两个机构提交。*