Low-cost Fully Monolithic RF Integrated Circuits for Wireless Applications

[9979292] schutt - aine， jos射频集成电路将强烈影响未来无线通信系统的多功能性和便携性。随着对更高带宽和容量的需求不断增加，以及对尺寸、重量和成本的减少，对更强大、更高效的射频电路的需求预计将增加。尽管无线电路技术最近取得了进展，但在下一代低成本便携式系统得以实施之前，仍有几个障碍有待克服。这些障碍需要在设计、建模、仿真、加工、制造和测试领域进行深入调查。在这项合作努力中，我们建议整合这些领域的资源，以便为未来的无线rfic设计实现最先进的方案。这项工作将利用微机电（MEM）器件加工的最新发展以及微波电路设计和加工中的其他技术。这种集成结合了强大的设计指南和低成本的包装方案，将代表着迈向下一代通信系统的重要一步。重要提示：本提案是伊利诺伊大学厄巴纳-香槟分校和佐治亚理工学院共同努力的成果，由两所大学共同提交

9979292Schutt-Aine, JoseRadio frequency integrated circuits will strongly influence the versatility and portability of fu-ture wireless communication systems. With the ever increasing demands for higher bandwidth and capacity and for reductions in size, weight and cost, the need for more robust and efficient RF cir-cuits is expected to increase. In spite of recent advances in wireless circuit technology, several bar-riers still remain to be overcome before the next generation Low-cost portable systems can be im-plemented. These barriers require in-depth investigations in areas of design, modeling, simulation, processing, fabrication and testing. In this collaborative effort, we propose to integrate resources in these areas in order to implement a state-of-the art scheme for the design of future wireless RFICs. This effort will take advantage of recent developments in the processing of micro-electro-mechanical (MEM) devices as well as other technologies in microwave circuit design and process-ing. This integration combined with robust design guidelines and a low-cost packaging scheme will represent a substantial step towards the next generation communication system.IMPORTANT NOTE: This proposal is a joint effort between the University of Illinois at Urbana-Champalgn and the Georgia Institute of Technology and is being submitted by both institu-tions.***