Analysis and Design of Interconnects for Microelectronics Applications (Minority Research Initiation)

在制造高速 设备和更高水平的需求不断增加 数字电路的集成已经导致了一些 网络设计的重大变化， 计算机，以及它们的互连，都在芯片上 然后离开 目前，随着上升时间的加快， 更短的延迟和更高的频率， 分析和直接模拟 涉及网络，不再可能使用 旧的工具。 必须开发更复杂、更 复杂的模型和分析工具， 组件之间的互连电路 网络。 计算机辅助设计（CAD）工具 在帮助这一分析方面发挥着至关重要的作用， 互连的设计和仿真。 测量技术在以下方面发挥着积极作用： 确定设计方法的准确性 以及所考虑的设计的可行性。 实验室模拟允许与 计算机模拟和精度验证 模拟技术。 最后，新 必须设计和分析互连方案 以取代旧的方法。 的目的 这项研究旨在提供一个更好的 了解的行为和性能的 微电子封装中的互连， 高速数字网络应用。 三 在研究中可以区分出一些重要的方面： 1)建立准确的模型和分析 互连中的信号传播; 2）实验 互连的表征;以及3） 一个基于互连实现 计算机辅助设计模拟程序。

Progress made in the fabrication of high-speed devices and the increasing demand for a higher level of integration in digital circuits have led to several important changes in the design of networks and computers, and in their interconnections, both on-chip and off. At present, with the faster rise times, shorter delays and higher frequencies involved simple analysis and straightforward simulation of the networks are involved and no longer possible using the old tools. It is essential to develop more complex and more sophisticated models and analysis tools for simulating the interconnecting circuits between components of the network. Computer-aided design (CAD) tools play an essential role in helping this analysis, in both the design and the simulation of the interconnects. Measurement techniques play an active role in determining the accuracy of the design methods as well as the feasibility of the design considered. Laboratory simulations allow a comparison with computer simulations and verification of the accuracy of the simulation techniques. Finally, new interconnect schemes must be devised and analyzed to replace older methodologies. The object of the proposed research is to provide a better understanding of the behavior and performance of interconnections in microelectronics packaging and high-speed digital network applications. Three important aspects can be distinguished in the study: 1) development of accurate models and analysis of signal propagation in interconnects; 2) experimental characterization of interconnections; and 3) implementation of an interconnect-based computer-aided design simulation program.