Mathematical Sciences: VIP/ Virtual Integrated Processing ofYBCO Thin Films

这是一个多学科项目，主要研究YBa2Cu3O7-x （YBCO）薄膜金属有机化学气相沉积（MOCVD）的建模、仿真和控制。该项目团队由来自四所大学（加州理工学院、纽约大学Courant研究所、明尼苏达大学和科罗拉多矿业学院）的高级研究人员组成，并与工业合作伙伴超导技术公司（STI）合作。超导薄膜器件在许多应用中具有巨大的经济潜力，例如用作紧凑、高性能的微波滤波器。然而，为了使这项技术在经济上可行，必须开发一种高通量、低单位成本的超导薄膜沉积工艺。金属有机气相沉积是一种很有前途的技术。目标是使用数学工具和方法来实现虚拟原型和控制一个强大的、高通量的MOCVD工艺，用于制造适用于微波滤波器件的YBCO薄膜。这项工作将跨越几个领域，包括：外延YBCO薄膜生长的基础研究；基于基本原理的YBCO MOCVD预测模型的开发；基于仿真驱动的先进MOCVD原型反应器的设计和建造，集成传感和控制；以及基于模型的过程控制策略的开发和实验验证。该活动的资金将由数学科学部、MPS多学科活动办公室、NSF工程局和DARPA提供。

This is a multidisciplinary project focused on modeling, simulation, and control of metalorganic chemical vapor deposition (MOCVD) of YBa2Cu3O7-x (YBCO) thin films. The project team is composed of senior investigators from four universities (California Institute of Technology, New York University's Courant Institute, the University of Minnesota, and the Colorado School of Mines), working together with an industrial partner, Superconductor Technologies, Inc. (STI). Superconducting thin film devices have enormous economic potential in several applications, for example as compact, high-performance microwave filters. However, to make this technology economically viable, a high-throughput, low-unit-cost superconducting thin film deposition process must be developed. One promising technique is metalorganic CVD. The goal is to use mathematical tools and methods to enable virtual prototyping and control of a robust, high-throughput MOCVD process for manufacturing YBCO thin films suitable for microwave filter devices. The work will span several fields, and will include * fundamental investigations of epitaxial YBCO film growth * development of predictive models for MOCVD of YBCO based on fundamental principles, * simulation-driven design and construction of an advanced, prototype MOCVD reactor with integrated sensing and control * and development and experimental validation of model-based process control strategies. Funding for this activity will be provided by the Division of Mathematical Sciences, the MPS Office of Multidisciplinary Activities, the NSF Engineering Directorate, and by DARPA.