Optoelectronic Devices, Interconnects, and Packaging (COEDIP Center)

光电器件、互连和封装（COEDIP 中心）

• 批准号: 0086554
• 负责人: Aristos Christou
• 金额: $ 22.5万
• 依托单位: University of Maryland, College Park
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2000
• 资助国家: 美国
• 起止时间: 2000-09-01 至 2003-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0086554&HistoricalAwards=false
• 关键词: Optoelectronic; Devices; Interconnects; Packaging; COEDIP

The University of Arizona and the University of Maryland are proposing the renewal of their successful joint Industry/University Cooperative Research Centers (I/UCRC), entitled "The Center for Optoelectronic Devices Interconnect and Packaging (COEDIP)" under the sponsorship of the National Science Foundation. The Center was created five years ago to promote collaborative research between the two Universities and industries based on their strengths in the field of optoelectronics components, packaging and interconnection. The major goals of the Center are:- To promote collaboration and joint projects between the two universities;- To transfer new technology developed within each university to their industrial partners; and- To train highly qualified students and promote their interaction with industries.

亚利桑那大学和马里兰大学正在提议更新他们成功的联合产学研合作研究中心（I/UCRC），名为“光电器件互连和封装中心（COEDIP）”，由国家科学基金会赞助。该中心成立于五年前，旨在基于两校在光电元件、封装和互连领域的优势，促进两校和产业之间的合作研究。中心的主要目标是：-促进两所大学之间的合作和联合项目；-将各大学开发的新技术转让给其工业伙伴；培养高素质的学生，促进他们与行业的互动。