Optoelectronic Devices, Interconnects, and Packaging (COEDIP Center)

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The University of Arizona and the University of Maryland are proposing the renewal of their successful joint Industry/University Cooperative Research Centers (I/UCRC), entitled "The Center for Optoelectronic Devices Interconnect and Packaging (COEDIP)" under the sponsorship of the National Science Foundation. The Center was created five years ago to promote collaborative research between the two Universities and industries based on their strengths in the field of optoelectronics components, packaging and interconnection. The major goals of the Center are:- To promote collaboration and joint projects between the two universities;- To transfer new technology developed within each university to their industrial partners; and- To train highly qualified students and promote their interaction with industries.