SBIR Phase I: Optically Addressable High-Density Interconect

这项小型企业创新研究（SBIR）第一阶段提出的创新是一种基于光栅耦合表面等离子体共振现象的光学寻址、动态可重构、双向、高密度的光学互连微阵列。提出的器件解决了高度并行的下一代计算系统对密集、快速、低功耗互连技术的需求。这些系统将需要包含许多长途连接的高度密集的连接网络。在这种高度连接、高度并行的系统中，模块对模块和长距离芯片对芯片的连接是造成大部分功耗、时延和表面积的原因。因此，最小化芯片对芯片和模块对模块互连的面积、功耗和时间延迟，同时增加密度和带宽变得至关重要。潜在的商业应用程序将在许多商业市场中找到适用性。其中包括电子器件，通用mems制造和光刻中的新兴互连器件，这将节省时间并消除昂贵的掩模工艺。空间光调制器的其他潜在市场包括光学处理、电信中的某些应用和其他杂项应用。

This Small Business Innovation Research (SBIR)Phase I proposed innovation is an optically addressable, dynamically reconfigurable, bi-directional, high-density, optical interconnect micro-array based on the phenomenon of grating-coupled surface plasmon resonance). The proposed device addresses the need for dense, fast, low power dissipation interconnect technology created by highly parallel, next generation computationalsystems. These systems will require highly dense connection networks containing manylong-distance connections. In such highly connected, highly parallel systems, the module-to-module and long distance chip-to-chip connections are responsible for the majority of the power dissipation, time delay and surface area. Thus, it has become critically important to minimize the area, power and time delay of thechip-to-chip and module-to-module interconnects while, at the same time,increasing density and bandwidth. Potential commercial applications effort will find applicability in a number of commercial markets. These include emerging interconnect devices in electronics, generalMEMs fabrication and in photolithography, where it would save time and eliminate expensive photomasking processes. Other potential markets includeoptical processing, certain applications in telecommunications and other miscellaneous applications for spatial light modulators.