CAREER: Fundamental Research on Silicon Wafer Fine Grinding to Foster a Quantum Leap in Manufacturing of Silicon Wafers
CAREER: Fundamental Research on Silicon Wafer Fine Grinding to Foster a Quantum Leap in Manufacturing of Silicon Wafers
批准号:
0348290
负责人:
Zhijian Pei
金额:
$40.0万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2004
资助国家:
美国
项目状态:
已结题
起止时间:
2004-02-15 至 2012-01-31
中文摘要
这一学院早期职业发展(CALEAR)奖支持硅片精细研磨的基础研究,以及将研究成果和其他进步整合到工程教育中。这项研究的目的是加深对硅片精磨的理解和了解,为开发创新的晶圆工艺流程提供必要的知识。具体地说,研究将建立数学模型来预测磨痕的距离和轨迹以及卡盘形状对磨痕的影响,以及物理模型来解释硅片精磨中最深处亚表面裂纹的产生机理和砂轮的自修整机理,并通过实验对这些模型进行验证。教育活动包括通过课程、教科书和互联网论坛改善制造业教育;通过网站、在线课程和研讨会接触行业;让妇女/少数民族学生和K-12教师参与。研究活动的结果将使晶圆制造商能够以低成本生产高质量的晶圆。这将导致更便宜、更好的电子产品,这将有利于经济和社会。研究的成功还将对环境产生积极影响,因为磨削将取代研磨、蚀刻和抛光的主要部分。这将消除或减少对环境有害的磨料和化学品的使用。这些教育举措将加强堪萨斯州立大学的制造工程课程,促进工业从业者的终身学习,并扩大代表不足的群体参与研究的范围。
英文摘要
This Faculty Early Career Development (CAREER) award supports fundamental research on silicon wafer fine grinding, and integration of research results and other advances into engineering education. The objective of the research is to generate the understanding and knowledge of silicon wafer fine grinding necessary for the development of an innovative wafering process flow. Specifically, the research will develop mathematical models to predict the distance and locus of grinding marks and the effects of the chuck shape on grinding marks, and physical models to explain the generation mechanisms of the deepest subsurface cracks and the self-dressing mechanisms of grinding wheels in silicon wafer fine grinding; and validate these models by experiments. The educational activities include improving manufacturing education through curricula, a textbook, and an Internet forum; reaching out to industry through a Web site, online courses, and workshops; and involving women/minority students and K-12 teachers.The results of the research activities will enable wafer manufacturers to produce high quality wafers at low cost. This will result in cheaper and better electronic products, which will benefit the economy and society. Success of the research will also have a positive impact on the environment, because grinding will replace lapping, etching, and a major portion of polishing. This will eliminate or reduce use of environmentally detrimental abrasive slurry and chemicals. The educational initiatives will strengthen the manufacturing engineering program at Kansas State University, promote lifelong learning for industrial practitioners, and broaden participation of the underrepresented groups in research.
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