CAREER: Fundamental Research on Silicon Wafer Fine Grinding to Foster a Quantum Leap in Manufacturing of Silicon Wafers

事业：硅片精磨基础研究，促进硅片制造的飞跃

• 批准号: 0348290
• 负责人: Zhijian Pei
• 金额: $ 40万
• 依托单位: Kansas State University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2004
• 资助国家: 美国
• 起止时间: 2004-02-15 至 2012-01-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0348290&HistoricalAwards=false
• 关键词: CAREER; Fundamental; Research; Silicon; Wafer

This Faculty Early Career Development (CAREER) award supports fundamental research on silicon wafer fine grinding, and integration of research results and other advances into engineering education. The objective of the research is to generate the understanding and knowledge of silicon wafer fine grinding necessary for the development of an innovative wafering process flow. Specifically, the research will develop mathematical models to predict the distance and locus of grinding marks and the effects of the chuck shape on grinding marks, and physical models to explain the generation mechanisms of the deepest subsurface cracks and the self-dressing mechanisms of grinding wheels in silicon wafer fine grinding; and validate these models by experiments. The educational activities include improving manufacturing education through curricula, a textbook, and an Internet forum; reaching out to industry through a Web site, online courses, and workshops; and involving women/minority students and K-12 teachers.The results of the research activities will enable wafer manufacturers to produce high quality wafers at low cost. This will result in cheaper and better electronic products, which will benefit the economy and society. Success of the research will also have a positive impact on the environment, because grinding will replace lapping, etching, and a major portion of polishing. This will eliminate or reduce use of environmentally detrimental abrasive slurry and chemicals. The educational initiatives will strengthen the manufacturing engineering program at Kansas State University, promote lifelong learning for industrial practitioners, and broaden participation of the underrepresented groups in research.

该学院早期职业发展（CAREER）奖支持硅晶片精细研磨的基础研究，以及研究成果和其他进展与工程教育的整合。本研究的目的是产生的理解和知识的硅晶片精细研磨所需的发展创新的晶圆加工工艺流程。具体而言，本研究将建立数学模型来预测磨削痕迹的距离和轨迹以及卡盘形状对磨削痕迹的影响，并建立物理模型来解释硅片精磨中最深亚表面裂纹的产生机制和砂轮的自修整机制，并通过实验验证这些模型。教育活动包括通过课程、教科书和互联网论坛改善制造业教育;通过网站、在线课程和讲习班与工业界接触;让妇女/少数民族学生和K-12教师参与研究活动的结果将使晶圆制造商能够以低成本生产高质量晶圆。这将导致更便宜和更好的电子产品，这将有利于经济和社会。研究的成功也将对环境产生积极的影响，因为研磨将取代研磨，蚀刻和抛光的主要部分。这将消除或减少对环境有害的磨料浆和化学品的使用。这些教育举措将加强堪萨斯州立大学的制造工程项目，促进工业从业人员的终身学习，并扩大代表性不足的群体在研究中的参与。