Self-Assembled Molecular Nanolayers for Interfacial Isolation in Device Interconnections

用于器件互连中界面隔离的自组装分子纳米层

• 批准号: 0501488
• 负责人: Ganpati Ramanath
• 金额: --
• 依托单位: Rensselaer Polytechnic Institute
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2005
• 资助国家: 美国
• 起止时间: 2005-05-01 至 2008-10-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0501488&HistoricalAwards=false
• 关键词: Self; Assembled; Molecular; Nanolayers; Interfacial

The objective of this research is to investigate self-assembled molecular layers as interface chemical isolators in microdevice structures to enable new high-reliability device technologies. The approach is harness the effects of the molecular termini and length of organosilane nanolayers to enhance the chemical and structural integrity of thin film device interfaces. Device structures with the organosilane nanolayers at interfaces of metal-dielectric thin film structures will be fabricated, and used to characterize the roles of molecular termini, length, multilayering, and lateral/interlayer cross-linking nanolayers on parameters such as impurity-induced leakage currents, interface contact resistivity and capacitance, and interfacial adhesion. The effects of thermal treatments, step-coverage and defects, on electrical properties and chemical stability, will be studied by combining electrical device tests with microscopy and spectroscopy techniques, to develop an understanding of property enhancement and device failure mechanisms. This work will directly impact future device technologies by enabling the use of self-assembled structures in conventional devices, and contribute to bridging the gap between conventional microelectronics and emerging molecular device technologies. Additionally, it provides a unique opportunity for cross-disciplinary training to graduate and undergraduate students through research in molecular self-assembly, device fabrication, testing and materials characterization, international and industrial collaborations. The research will be integrated in the Nanostructured Materials course through a module on fabrication and properties of molecular layer-modified device structures. Site-visits and modular presentations are planned to increase the awareness for K-12 school students and science teachers on self-assembly, properties and applications of molecular layers, for integration in their science classes.

这项研究的目的是研究自组装分子层作为微器件结构中的界面化学隔离层，以实现新的高可靠性器件技术。该方法是利用有机硅烷纳米层的分子末端和长度的影响来增强薄膜器件界面的化学和结构完整性。在金属-介质薄膜结构的界面上制备有机硅烷纳米层的器件结构，并用来表征分子末端、长度、多层和横向/层间交联纳米层对杂质诱导的泄漏电流、界面接触电阻和电容以及界面粘附性等参数的影响。将结合电气设备测试、显微镜和光谱分析技术，研究热处理、阶跃覆盖和缺陷对电学性能和化学稳定性的影响，以加深对性能增强和设备故障机理的理解。这项工作将直接影响未来的器件技术，使自组装结构能够在传统器件中使用，并有助于弥合传统微电子学和新兴分子器件技术之间的差距。此外，它还通过分子自组装、设备制造、测试和材料表征、国际和行业合作等方面的研究，为研究生和本科生提供了一个独特的跨学科培训机会。这项研究将通过一个关于分子层修饰器件结构的制备和性能的模块，整合到纳米结构材料课程中。计划进行实地访问和模块演示，以提高K-12学校的学生和科学教师对分子层的自组装、性质和应用的认识，以便整合到他们的科学课堂中。