CAREER: Microstructure Evolution and Interfacial Reaction Paths in Cu Alloy Thin Films

职业：铜合金薄膜中的微观结构演变和界面反应路径

• 批准号: 9984478
• 负责人: Ganpati Ramanath
• 金额: $ 32.48万
• 依托单位: Rensselaer Polytechnic Institute
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2000
• 资助国家: 美国
• 起止时间: 2000-01-15 至 2005-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9984478&HistoricalAwards=false
• 关键词: CAREER; Microstructure; Evolution; Interfacial; Reaction

9984478RamanathThis grant seeks an atomic-level understanding of solute-induced grain size and texture evolution in metal alloy films. A goal is to correlate the effects of microstructure and interface chemistry on film properties. Systematic studies are carried out on two model systems, Cu-Mg and Cu-Al, chosen based on their low and high solid-solubilities, respectively, to reveal the effects of solubility and supersaturation on microstructure and interface chemistry evolution. The specific interrelated goals are: 1) reveal the sequence and kinetics of solute segregation, grain growth, and interfacial reactions during film growth and post-deposition annealing; 2) reveal solute segregation paths (e.g., inter- vs. intra-granular) and surface/interface morphology, structure, and chemistry; 3) understand the influence of precipitate morphology, precipitate-matrix crystallography (e.g. coherency), and interface chemistry on grain size and texture evolution; and 4) understand the effects of texture and solute additions on electromigration, and interface chemistry on oxidation and diffusion barrier properties. The overall thrust of the CAREER educational plan is to develop innovative teaching tools and methods to enable students to acquire top-quality technical knowledge, assimilate the art of learning independently, and prepare them for successful professional careers. The distance-learning Materials Characterization course will be converted into an interactive format and a graduate seminar course and an undergraduate elective on thin film materials and processing will be created as well as computer/video modules related to thin film materials for integration in interactive class sessions of the above courses and outreach activities.%%%The resulting knowledge will enable the tailoring of film properties by atomic-level control of microstructure and interface chemistry through strategic solute additions and annealing. The focus is on copper alloys because of the importance of Cu for interconnect applications in microelectronics. Solute additions to Cu have shown promise for preventing Cu diffusion into silica thereby improving adhesion and electromigration resistance. It is essential to reveal the mechanisms of solute-induced film-property enhancements in Cu films to reproducibly create smaller (faster) and more reliable interconnect structures through alloying.***

9984478 Ramanath该资助旨在从原子水平上了解金属合金薄膜中溶质诱导的晶粒尺寸和织构演变。一个目标是将微观结构和界面化学对薄膜性能的影响联系起来。 系统地研究了Cu-Mg和Cu-Al两个模型体系的固溶度和过饱和度对微观组织和界面化学演化的影响。具体的相关目标是：1）揭示在膜生长和沉积后退火期间溶质偏析、晶粒生长和界面反应的顺序和动力学; 2）揭示溶质偏析路径（例如，颗粒间与颗粒内）和表面/界面形态、结构和化学; 3）理解沉淀物形态、沉淀物-基质晶体学（例如相干性）和界面化学对晶粒尺寸和织构演化的影响;以及4）理解织构和溶质添加对电迁移的影响，以及界面化学对氧化和扩散阻挡特性的影响。 CAREER教育计划的总体目标是开发创新的教学工具和方法，使学生能够获得高质量的技术知识，吸收独立学习的艺术，并为成功的职业生涯做好准备。 远程学习材料表征课程将转换为互动形式，并将创建研究生研讨会课程和薄膜材料与加工的本科生选修课，以及与薄膜材料相关的计算机/视频模块，以整合到上述课程和推广活动的互动课堂中。由此产生的知识将使定制的薄膜性能的微观结构和界面化学通过战略溶质添加和退火的原子级控制。 重点是铜合金，因为铜在微电子互连应用的重要性。 向Cu中添加溶质已显示出防止Cu扩散到二氧化硅中从而改善粘附性和抗电迁移性的前景。 揭示Cu膜中溶质诱导的膜性质增强的机制对于通过合金化可重复地创建更小（更快）和更可靠的互连结构至关重要。