Fixtureless Stress-Engineered Test Methods for the Measurement of Interfacial Fracture Toughness for Micro- and Nano-scale Thin-film Interfaces

用于测量微米级和纳米级薄膜界面的界面断裂韧性的无夹具应力工程测试方法

• 批准号: 0510211
• 负责人: Suresh Sitaraman
• 金额: $ 19万
• 依托单位: Georgia Tech Research Corporation
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2005
• 资助国家: 美国
• 起止时间: 2005-08-15 至 2007-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0510211&HistoricalAwards=false
• 关键词: Fixtureless; Stress; Engineered; Test; Methods

Micro- and nano-scale thin films are being increasingly used in a wide range of applications, and the experimental characterization of interfacial properties of such thin films is challenging, yet necessary for design against interfacial delamination. This proposal aims to develop an innovative fixture-less superlayer based decohesion test with a sandwiched etchable release layer to measure the interfacial fracture toughness of a thin film deposited on a substrate. Two versions of the proposed test will be developed: in the single-substrate version, the release layer will have a uniform width, while in the single-strip version, the release layer will have a varying width. Case studies will focus primarily on microelectronics and composite materials for automotive/structural applications. Thin-films with thickness ranging from 50 nm to few microns will be studied. Efforts will be made to standardize the developed approach through professional and testing societies, and peer-reviewed articles will be published. Students will gain experience with clean-room processing. K-12 students and high-school teachers will also participate.

微纳尺度薄膜的应用日益广泛，其界面性质的实验表征是一项具有挑战性的工作，也是进行抗界面分层设计所必需的。这一建议旨在开发一种创新的基于无夹具的超层层的去粘合测试，该测试具有夹层可腐蚀释放层，用于测量沉积在衬底上的薄膜的界面断裂韧性。拟议的测试将开发两个版本：在单衬底版本中，释放层将具有统一的宽度，而在单条版本中，释放层将具有不同的宽度。案例研究将主要集中在汽车/结构应用的微电子和复合材料上。厚度从50纳米到几微米的薄膜将被研究。将通过专业和测试协会努力使制定的方法标准化，并将发表同行评议的文章。学生将获得洁净室处理的经验。K-12年级的学生和高中教师也将参加。