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Non-Contact Experimental Technique to Characterize Interfacial Crack Propagation in Nano-Scale and Micro-Scale Thin Films

Non-Contact Experimental Technique to Characterize Interfacial Crack Propagation in Nano-Scale and Micro-Scale Thin Films
表征纳米级和微米级薄膜中界面裂纹扩展的非接触实验技术
批准号:
0800037
负责人:
Suresh Sitaraman
金额:
$25.0万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2008
资助国家:
美国
项目状态:
已结题
起止时间:
2008-05-01 至 2012-05-31

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中文摘要
翻译
薄膜界面脱层是一个重要的可靠性问题,在广泛的应用。虽然大量的界面脱层是由疲劳载荷引起的,但现有文献没有充分解决这个问题,特别是对于纳米尺度的薄膜。该提案旨在开发一种创新的疲劳脱层测试,可用于监测和表征纳米尺度以及微米尺度薄膜的界面脱层传播。所提出的测试具有几个智能方面:它使用纳米级金属迹线来监测分层传播;它使用电磁致动来提供分层传播所需的驱动力,因此测试方法不需要任何夹具来施加负载;使用放置在外部磁场中并具有原位裂纹扩展能力的悬臂梁阵列,提出的测试技术将是界面疲劳裂纹测试的一个重大进步。纳米级薄膜正越来越多地用于广泛的应用中,例如固态器件、集成电子元件、传感器、MEMS/NEMS、用于更好的光传输的抗反射光学膜、显示技术中的导电膜、太阳能电池中的薄膜涂层、用于介质存储的磁性涂层以及用于空间探索的柔性和可弯曲透镜。拟议的研究将对它们的可靠性产生重大影响。 研究方法和研究结果将被整合到研究生和本科教育中。 此外,学生将接触到纳米尺度的薄膜制造和测试。 研究方法和结果将发表在技术期刊上,并在会议上介绍,以达到广泛的受众。
英文摘要
Thin film interfacial delamination is an important reliability concern in a wide range of applications. Although a significant amount of interfacial delamination is caused by fatigue loading, existing literature has not adequately addressed this topic, especially for nano-scale thin films. This proposal aims to develop an innovative fatigue delamination test that can be used to monitor and characterize interfacial delamination propagation for nano-scale as well as micro-scale thin films. The proposed test has several intellectual aspects: it uses nano-scale metal traces to monitor the delamination propagation; it uses electromagnetic actuation to provide the driving force needed for delamination propagation, and thus the test method does not require any fixtures to apply loads; using an array of cantilevers placed in an external magnetic field and with in-situ crack propagation capabilities, the proposed test technique will be a significant advancement in interfacial fatigue crack testing. Nano-scale thin films are being increasingly used in a wide range of applications such as solid-state devices, integrated electronic components, sensors, MEMS/NEMS, antireflective optical films for better light transmission, conductive films in display technologies, thin-film coating in solar cells, magnetic coatings for media storage, and flexible and bendable lenses for space exploration. The proposed research will have a strong impact on their reliability. The research approach and the findings will be integrated in graduate and undergraduate education. Also, students will get exposure to nano-scale thin film fabrication and testing. The research methodology and results will be published in technical journals and presented in conferences to reach a wide-ranging audience.
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会议论文
DEVELOPMENT OF COMPLIANT FREE-STANDING STRUCTURES FOR SUB 32-nm MULTI-CORE ICs
  • 批准号:
    0901679
  • 项目类别:
    Standard Grant
  • 资助金额:
    $35.0万
  • 财政年份:
    2009
  • 负责人:
    Suresh Sitaraman
  • 依托单位:
Fixtureless Stress-Engineered Test Methods for the Measurement of Interfacial Fracture Toughness for Micro- and Nano-scale Thin-film Interfaces
  • 批准号:
    0510211
  • 项目类别:
    Standard Grant
  • 资助金额:
    $19.0万
  • 财政年份:
    2005
  • 负责人:
    Suresh Sitaraman
  • 依托单位:
SGER: Innovative Off-Chip Interconnects for 45-nm and sub-45-nm Node ICs
  • 批准号:
    0539023
  • 项目类别:
    Standard Grant
  • 资助金额:
    $0.0万
  • 财政年份:
    2005
  • 负责人:
    Suresh Sitaraman
  • 依托单位:
CAREER: Implantable Medical Devices: A Process-Modeling Approach to High Reliability Miniaturization
  • 批准号:
    9702285
  • 项目类别:
    Continuing Grant
  • 资助金额:
    $28.5万
  • 财政年份:
    1997
  • 负责人:
    Suresh Sitaraman
  • 依托单位:
海外基金