Non-Contact Experimental Technique to Characterize Interfacial Crack Propagation in Nano-Scale and Micro-Scale Thin Films

表征纳米级和微米级薄膜中界面裂纹扩展的非接触实验技术

基本信息

  • 批准号:
    0800037
  • 负责人:
  • 金额:
    $ 25万
  • 依托单位:
  • 依托单位国家:
    美国
  • 项目类别:
    Standard Grant
  • 财政年份:
    2008
  • 资助国家:
    美国
  • 起止时间:
    2008-05-01 至 2012-05-31
  • 项目状态:
    已结题

项目摘要

Thin film interfacial delamination is an important reliability concern in a wide range of applications. Although a significant amount of interfacial delamination is caused by fatigue loading, existing literature has not adequately addressed this topic, especially for nano-scale thin films. This proposal aims to develop an innovative fatigue delamination test that can be used to monitor and characterize interfacial delamination propagation for nano-scale as well as micro-scale thin films. The proposed test has several intellectual aspects: it uses nano-scale metal traces to monitor the delamination propagation; it uses electromagnetic actuation to provide the driving force needed for delamination propagation, and thus the test method does not require any fixtures to apply loads; using an array of cantilevers placed in an external magnetic field and with in-situ crack propagation capabilities, the proposed test technique will be a significant advancement in interfacial fatigue crack testing. Nano-scale thin films are being increasingly used in a wide range of applications such as solid-state devices, integrated electronic components, sensors, MEMS/NEMS, antireflective optical films for better light transmission, conductive films in display technologies, thin-film coating in solar cells, magnetic coatings for media storage, and flexible and bendable lenses for space exploration. The proposed research will have a strong impact on their reliability. The research approach and the findings will be integrated in graduate and undergraduate education. Also, students will get exposure to nano-scale thin film fabrication and testing. The research methodology and results will be published in technical journals and presented in conferences to reach a wide-ranging audience.
薄膜界面脱层是一个重要的可靠性问题,在广泛的应用。虽然大量的界面脱层是由疲劳载荷引起的,但现有文献没有充分解决这个问题,特别是对于纳米尺度的薄膜。该提案旨在开发一种创新的疲劳脱层测试,可用于监测和表征纳米尺度以及微米尺度薄膜的界面脱层传播。所提出的测试具有几个智能方面:它使用纳米级金属迹线来监测分层传播;它使用电磁致动来提供分层传播所需的驱动力,因此测试方法不需要任何夹具来施加负载;使用放置在外部磁场中并具有原位裂纹扩展能力的悬臂梁阵列,提出的测试技术将是界面疲劳裂纹测试的一个重大进步。纳米级薄膜正越来越多地用于广泛的应用中,例如固态器件、集成电子元件、传感器、MEMS/NEMS、用于更好的光传输的抗反射光学膜、显示技术中的导电膜、太阳能电池中的薄膜涂层、用于介质存储的磁性涂层以及用于空间探索的柔性和可弯曲透镜。拟议的研究将对它们的可靠性产生重大影响。 研究方法和研究结果将被整合到研究生和本科教育中。 此外,学生将接触到纳米尺度的薄膜制造和测试。 研究方法和结果将发表在技术期刊上,并在会议上介绍,以达到广泛的受众。

项目成果

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Suresh Sitaraman其他文献

Suresh Sitaraman的其他文献

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{{ truncateString('Suresh Sitaraman', 18)}}的其他基金

DEVELOPMENT OF COMPLIANT FREE-STANDING STRUCTURES FOR SUB 32-nm MULTI-CORE ICs
为低于 32 nm 的多核 IC 开发合规的独立式结构
  • 批准号:
    0901679
  • 财政年份:
    2009
  • 资助金额:
    $ 25万
  • 项目类别:
    Standard Grant
Fixtureless Stress-Engineered Test Methods for the Measurement of Interfacial Fracture Toughness for Micro- and Nano-scale Thin-film Interfaces
用于测量微米级和纳米级薄膜界面的界面断裂韧性的无夹具应力工程测试方法
  • 批准号:
    0510211
  • 财政年份:
    2005
  • 资助金额:
    $ 25万
  • 项目类别:
    Standard Grant
SGER: Innovative Off-Chip Interconnects for 45-nm and sub-45-nm Node ICs
SGER:适用于 45 纳米和 45 纳米以下节点 IC 的创新片外互连
  • 批准号:
    0539023
  • 财政年份:
    2005
  • 资助金额:
    $ 25万
  • 项目类别:
    Standard Grant
CAREER: Implantable Medical Devices: A Process-Modeling Approach to High Reliability Miniaturization
职业:植入式医疗设备:高可靠性小型化的流程建模方法
  • 批准号:
    9702285
  • 财政年份:
    1997
  • 资助金额:
    $ 25万
  • 项目类别:
    Continuing Grant

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