SBIR Phase I: Simulation Model for Two-Photon Absorption Fabricated Microstructures

这个小型企业创新研究第一阶段研究项目将开发一种制造模拟工具，用于对由双光子吸收(TPA)制造形成的三维微纳结构进行理论建模。这项工作将集中在建立一个用TPA来预测特征尺寸的理论模型，用光束写入速度来量化曝光时间和光通量，并对该模型进行验证。一旦结构几何控制得到验证，该模拟工具将构成器件和制造建模工具的基础，该工具可以加快使用TPA进行设计的优化。该工具将实现几何结构，并最终作为器件性能的验证工具，通过耦合适用于每种应用的额外元素，并将结构和材料属性转换为器件特性(即光子器件性能和机械工程性能模型)。集成电路(IC)技术和硅微机械加工从将模拟和建模工具整合到组件、器件和系统的设计、开发和评估中受益匪浅。这提供了一种快速评估新晶片组件和设计成本效益的方法，并避免了通过物理设计迭代进行昂贵的经验优化。TPA技术将为微米和亚微米组件设备和系统提供世界上第一个真正的3D无掩模制造平台，与传统的IC制造非常相似，需要能够优化制造性能的建模工具。

This Small Business Innovation Research Phase I research project will develop a fabrication simulation tool for theoretical modeling of three-dimensional micro and nanostructures formed by Two-Photon Absorption (TPA) fabrication. This work will focus on development of a theoretical model for prediction of feature size using TPA quantifying exposure time and optical flux with optical beam writing speed and the validation of the model. Once structural geometry control has been validated this simulation tool will form the base of a device and fabrication modeling tool that can expedite optimization of designs using TPA. The tool will enable geometric structuring and ultimately serve as a validation tool for device performance by coupling additional elements appropriate to each application and translating the structural and materials properties into device characteristics (i.e. photonic device performance and mechanical engineering performance models).Integrated Circuit (IC) technology and silicon micromachining has benefited greatly from the incorporation of simulation and modeling tools into the design, development and evaluation of the components, devices, and systems. This has provided a rapid means to deterministically evaluate new wafer components and designs cost effectively, and avoid the expensive, empirical optimization through physical design iterations. TPA technology will allow for the world's first truly 3D maskless, fabrication platform for micro and sub - micron components devices and systems, and much like traditional IC fabrication requires modeling tools that can optimize fabrication performance.