SBIR Phase I: Simulation Model for Two-Photon Absorption Fabricated Microstructures

这个小企业创新研究第一阶段的研究项目将开发一个制造模拟工具，用于通过双光子吸收（TPA）制造形成的三维微米和纳米结构的理论建模。这项工作将集中在一个理论模型的发展预测的特征尺寸使用TPA量化曝光时间和光通量与光束写入速度和验证的模型。一旦结构几何控制得到验证，该仿真工具将成为器件和制造建模工具的基础，可以加快使用TPA的设计优化。该工具将实现几何结构化，并通过耦合适用于每种应用的附加元素并将结构和材料特性转化为器械特性，最终用作器械性能的验证工具（即光子器件性能和机械工程性能模型）。集成电路（IC）技术和硅微加工已经从将仿真和建模工具结合到组件、器件和系统的设计、开发和评估中大大受益。这提供了一种快速的手段，以确定性地评估新的晶圆组件和设计的成本效益，并避免昂贵的，经验的优化，通过物理设计迭代。TPA技术将允许世界上第一个真正的3D无掩模制造平台，用于微米和亚微米组件设备和系统，并且与传统的IC制造非常相似，需要能够优化制造性能的建模工具。

This Small Business Innovation Research Phase I research project will develop a fabrication simulation tool for theoretical modeling of three-dimensional micro and nanostructures formed by Two-Photon Absorption (TPA) fabrication. This work will focus on development of a theoretical model for prediction of feature size using TPA quantifying exposure time and optical flux with optical beam writing speed and the validation of the model. Once structural geometry control has been validated this simulation tool will form the base of a device and fabrication modeling tool that can expedite optimization of designs using TPA. The tool will enable geometric structuring and ultimately serve as a validation tool for device performance by coupling additional elements appropriate to each application and translating the structural and materials properties into device characteristics (i.e. photonic device performance and mechanical engineering performance models).Integrated Circuit (IC) technology and silicon micromachining has benefited greatly from the incorporation of simulation and modeling tools into the design, development and evaluation of the components, devices, and systems. This has provided a rapid means to deterministically evaluate new wafer components and designs cost effectively, and avoid the expensive, empirical optimization through physical design iterations. TPA technology will allow for the world's first truly 3D maskless, fabrication platform for micro and sub - micron components devices and systems, and much like traditional IC fabrication requires modeling tools that can optimize fabrication performance.