SBIR Phase I: Spatially selective metallization of microfabricated 3D structures and lines using Multiphoton Polymerization (MPP) for optical, photonic and electrical micro-systems

SBIR 第一阶段：使用多光子聚合 (MPP) 对光学、光子和电气微系统进行微加工 3D 结构和线条的空间选择性金属化

• 批准号: 0638055
• 负责人: Ian White
• 金额: --
• 依托单位: Focal Point Microsystems
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2007
• 资助国家: 美国
• 起止时间: 2007-01-01 至 2007-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0638055&HistoricalAwards=false
• 关键词: SBIR; Phase; Spatially; selective; metallization

This Phase I SBIR research project is directed to extending the unique 3D micro-fabrication capability of Multiphoton Induced Polymerization (MPP) technology to incorporate highly spatially selective metallization, in a three-dimensional micro-fabricated device or subsystem using a single-step fabrication process, fabricating the structure and defining the metallization sections simultaneously. Metallization and electrical conductivity are critical capabilities for any micro-fabrication technology in which the fabricated components are active elements. This creation of specific electrical paths throughout a microstructure is an intrinsic need for the extension of micro-fabrication to a truly monolithic scale of integrated components and systems by providing power delivery to components and control circuitry. The ability to do this in 3D structures enables a broad base of applications for micro-fabrication that are inaccessible with existing technologies.This proposal is directed towards extending the fabrication capabilities of MPP to include the ability to selectively position metallic paths and surfaces within such structures simultaneously with the structure formation itself. MPP's material base of organic polymers can be used in electronic, semiconductor and photonic devices. This enhanced MPP has the potential to fabricate extremely high quality optically flat surfaces without the need for polishing.

这个第一阶段的SBIR研究项目旨在扩展多光子诱导聚合(MPP)技术独特的3D微制造能力，将高度空间选择性的金属化纳入使用单步制造工艺的三维微制造设备或子系统中，同时制造结构和定义金属化部分。金属化和导电性是任何微制造技术的关键能力，在这些微制造技术中，所制造的部件是有源元件。这种在微结构中创建特定的电路径是通过向组件和控制电路提供电力传输将微制造扩展到集成组件和系统的真正整体规模的内在需要。在3D结构中实现这一点的能力使得现有技术无法访问的微制造的广泛应用基础。该提议旨在扩展MPP的制造能力，以包括在结构形成本身的同时在这种结构内选择性地定位金属路径和表面的能力。MPP的有机聚合物材料基础可用于电子、半导体和光子器件。这种增强型MPP有可能在不需要抛光的情况下制造极高质量的光学平整表面。