SBIR Phase I: Spatially selective metallization of microfabricated 3D structures and lines using Multiphoton Polymerization (MPP) for optical, photonic and electrical micro-systems

该第一阶段SBIR研究项目旨在扩展多光子诱导聚合（MPP）技术的独特3D微制造能力，以在三维微制造设备或子系统中使用单步制造工艺，同时制造结构并定义金属化部分，从而实现高度空间选择性金属化。金属化和导电性是任何微制造技术的关键能力，其中制造的组件是有源元件。通过向部件和控制电路提供功率输送，在整个微结构中产生特定的电路径是将微制造扩展到真正单片规模的集成部件和系统的内在需要。在3D结构中实现这一点的能力使得现有技术无法实现的微制造应用具有广泛的基础，该提议旨在扩展MPP的制造能力，以包括在结构形成本身的同时选择性地定位金属路径和表面的能力。MPP的有机聚合物材料基础可用于电子、半导体和光子器件。这种增强的MPP具有制造极高质量的光学平坦表面而无需抛光的潜力。

This Phase I SBIR research project is directed to extending the unique 3D micro-fabrication capability of Multiphoton Induced Polymerization (MPP) technology to incorporate highly spatially selective metallization, in a three-dimensional micro-fabricated device or subsystem using a single-step fabrication process, fabricating the structure and defining the metallization sections simultaneously. Metallization and electrical conductivity are critical capabilities for any micro-fabrication technology in which the fabricated components are active elements. This creation of specific electrical paths throughout a microstructure is an intrinsic need for the extension of micro-fabrication to a truly monolithic scale of integrated components and systems by providing power delivery to components and control circuitry. The ability to do this in 3D structures enables a broad base of applications for micro-fabrication that are inaccessible with existing technologies.This proposal is directed towards extending the fabrication capabilities of MPP to include the ability to selectively position metallic paths and surfaces within such structures simultaneously with the structure formation itself. MPP's material base of organic polymers can be used in electronic, semiconductor and photonic devices. This enhanced MPP has the potential to fabricate extremely high quality optically flat surfaces without the need for polishing.