SBIR Phase I: Spatially selective metallization of microfabricated 3D structures and lines using Multiphoton Polymerization (MPP) for optical, photonic and electrical micro-systems

SBIR 第一阶段：使用多光子聚合 (MPP) 对光学、光子和电气微系统进行微加工 3D 结构和线条的空间选择性金属化

• 批准号: 0638055
• 负责人: Ian White
• 金额: --
• 依托单位: Focal Point Microsystems
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2007
• 资助国家: 美国
• 起止时间: 2007-01-01 至 2007-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0638055&HistoricalAwards=false
• 关键词: SBIR; Phase; Spatially; selective; metallization

This Phase I SBIR research project is directed to extending the unique 3D micro-fabrication capability of Multiphoton Induced Polymerization (MPP) technology to incorporate highly spatially selective metallization, in a three-dimensional micro-fabricated device or subsystem using a single-step fabrication process, fabricating the structure and defining the metallization sections simultaneously. Metallization and electrical conductivity are critical capabilities for any micro-fabrication technology in which the fabricated components are active elements. This creation of specific electrical paths throughout a microstructure is an intrinsic need for the extension of micro-fabrication to a truly monolithic scale of integrated components and systems by providing power delivery to components and control circuitry. The ability to do this in 3D structures enables a broad base of applications for micro-fabrication that are inaccessible with existing technologies.This proposal is directed towards extending the fabrication capabilities of MPP to include the ability to selectively position metallic paths and surfaces within such structures simultaneously with the structure formation itself. MPP's material base of organic polymers can be used in electronic, semiconductor and photonic devices. This enhanced MPP has the potential to fabricate extremely high quality optically flat surfaces without the need for polishing.

第一阶段SBIR研究项目旨在扩展多光子诱导聚合（MPP）技术独特的3D微制造能力，在三维微制造设备或子系统中采用单步制造工艺，同时制造结构和定义金属化部分，从而结合高度空间选择性的金属化。金属化和导电性是任何微制造技术的关键能力，其中所制造的组件是活性元素。通过为元件和控制电路提供电力，在微结构中创建特定的电气路径是将微制造扩展到集成元件和系统的真正单片规模的内在需求。在3D结构中做到这一点的能力为现有技术无法实现的微制造提供了广泛的应用基础。该提案旨在扩展MPP的制造能力，包括在结构形成本身的同时选择性地定位这种结构中的金属路径和表面的能力。MPP的材料基础是有机聚合物，可用于电子、半导体和光子器件。这种增强的MPP有可能制造出极高质量的光学平面，而无需抛光。