Lab-on-a-Chip Channels Novel Manufacturing Method

芯片实验室开辟了新颖的制造方法

• 批准号: 0600231
• 负责人: Alex Volinsky
• 金额: --
• 依托单位: University of South Florida
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2006
• 资助国家: 美国
• 起止时间: 2006-04-15 至 2008-09-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0600231&HistoricalAwards=false
• 关键词: Lab; Chip; Channels; Novel; Manufacturing

The research objective of this effort is to investigate a novel method for manufacturing microchannels for lab-on-a-chip and Microelectromechanical Systems (MEMS) applications. The method is based on controlled thin film buckling, forming delamination blisters. These mechanically active features form by a local loss of adhesion between the film and the substrate due to residual stress relief, and exhibit directional growth. The geometry and path of the blisters will be controlled with lithographically-etched adhesion-weakening layers outlining the desired in-plane blister configuration. The out-of-plane dimensions will be controlled by the film residual stress. Thin film and coating buckling delamination is a truly multiscale phenomenon, so features ranging from tens of nanometers to centimeters in width are possible. In addition, compatibility with conventional microelectronic processing is very promising from the standpoint of full-scale on-chip integration. Fluid transport mechanisms, as well as the device reliability will be considered. Plans include students working in laboratory with a variety of instrumentation and equipment to fabricate the microchannels. If successful, the proposed research will greatly impact nano-manufacturing, MEMS, and medical fields. The proposed approach will enable cost-effective, multi-scale manufacturing of microchannels, leading to an ultimately robust manufacturing process. Possible applications include drug delivery, diagnostic devices and early cancer detection. The proposed work will also contribute to the experimental and analytical tools available for thin films processing. Students will gain valuable laboratory experience and knowledge of microfluidic fabrication techniques.

本论文的研究目的是探索一种新的用于芯片实验室和微机电系统（MEMS）应用的微通道制造方法。该方法是基于受控的薄膜屈曲，形成分层气泡。这些机械活性特征通过由于残余应力释放而导致的膜与衬底之间的粘附力的局部损失而形成，并且表现出定向生长。将通过光刻蚀刻的粘附力减弱层控制泡罩的几何形状和路径，从而勾勒出所需的平面内泡罩配置。面外尺寸将由薄膜残余应力控制。薄膜和涂层屈曲分层是一个真正的多尺度现象，因此宽度从几十纳米到厘米的特征是可能的。此外，从全尺寸片上集成的角度来看，与传统微电子处理的兼容性是非常有希望的。将考虑流体输送机制以及器械可靠性。计划包括学生在实验室工作，使用各种仪器和设备来制造微通道。如果成功，拟议的研究将极大地影响纳米制造，MEMS和医疗领域。所提出的方法将使微通道的成本效益，多规模制造，导致最终强大的制造工艺。可能的应用包括药物输送，诊断设备和早期癌症检测。拟议的工作也将有助于薄膜加工的实验和分析工具。学生将获得宝贵的实验室经验和微流体制造技术的知识。