SBIR Phase I: Low Thermal Resistance Graphite-Organic Matrix Thermal Interface Material for Use in High Power Electronics Packaging

该小型企业创新研究（SBIR）第一阶段项目的重点是开发独特的石墨-有机基质材料，作为热界面材料（TIM）应用于高功率电子封装。该项目的研究目标是了解拟议的石墨有机TIM的物理设计与其所得的机械性能和热性能之间的关系。所提出的石墨有机TIM技术预计具有比当前TIM低10倍的热阻。该SBIR第一阶段项目将发展对基本设计技术以及用于高温、大功率电子封装的石墨有机TIM技术的热和机械特性的基本理解。石墨-有机基质TIM材料的性质还没有得到很好的理解。本研究将建立石墨有机TIM设计与其性能之间的基本关系。该研究将产生所需的关键设计和性能知识，以实现石墨有机TIM，满足各种商业电子封装的高热性能，低成本要求。与目前使用的TIM相比，所得到的石墨-有机TIM技术将具有上级热性能。在商业上，所提出的技术将是加速基于下一代宽带隙半导体技术的高温、高功率电子封装的采用和商业化的关键。采用和广泛使用与高温、高功率半导体材料一起使用的更高性能的石墨-有机TIM将支持更高效的商业产品的开发，并且将以降低的能量消耗和改善的环境质量的形式为社会提供益处。

This Small Business Innovation Research (SBIR) Phase I project is focused on the development of unique, graphite-organic matrix materials for application as a thermal interface material (TIM) for use in high power electronics packaging. The research objective of this project is the development of an understanding of the relationship between the physical design of the proposed graphite-organic TIM and its resultant mechanical properties and thermal performance. The proposed graphite-organic TIM technology is expected to have a thermal resistance that is up to 10X lower than current TIMs. This SBIR Phase I project will develop the fundamental understanding of the basic design know-how as well as the thermal and mechanical characteristics for the proposed graphite-organic TIM technology for use in high temperature, high power electronics packaging. The properties of graphite-organic matrix TIM materials are not well understood. This research will establish the fundamental relationship between the graphite-organic TIM design and its performance. The research will produce the key design and performance knowledge required to enable a graphite-organic TIM that meets the high thermal performance, low-cost requirements of a variety of commercial electronic packages. The resulting graphite-organic TIM technology will have superior thermal performance compared to currently used TIMs. Commercially, the proposed technology will be key in accelerating the adoption and commercialization of high temperature, high power electronic packages based on next generation wide band gap semiconductor technology. The adoption and wide-spread use of the higher performance graphite-organic TIMs for use with the high temperature, high power semiconductor materials will support the development of commercial products that are more efficient and will provide benefits to society in the form of reduced energy consumption and improved environmental quality.