SBIR Phase II: Low-Cost Hot Press Die Casting of Graphite-Metal Materials

SBIR第二阶段：石墨金属材料的低成本热压压铸

• 批准号: 0823012
• 负责人: James Connell
• 金额: $ 49.97万
• 依托单位: ADVANCED THERMAL TECHNOLOGIES
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2008
• 资助国家: 美国
• 起止时间: 2008-07-01 至 2012-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0823012&HistoricalAwards=false
• 关键词: SBIR; Phase; II; Low; Cost

This Small Business Innovation Research (SBIR) Phase II project seeks to develop an unique hot press die casting technology to be used to produce graphite-metal materials. These materials will be used to produce packaging components for use in high power electronics packaging. There is a critical need for advanced materials with improved thermal properties capable of meeting the thermal management requirements of current and future high power electronic systems. The heat dissipation rate of electronic systems has increased dramatically, as a result of ongoing advances in semiconductor materials, compression of circuit physical architecture, size reduction of packaging envelops and faster switching speed. The technology developed in this project will enable the manufacture of cost effective graphite-metal packaging that offers improved thermal properties critical to thermal management solutions for next generation power electronics. The broader impact/commercial potential of this project will be the development of the hot press die casting technology for use in producing graphite-metal billet materials. The adoption and wide-spread use of the graphite-metal packaging products for electronic systems will enable commercial electronic devices based upon more efficient higher power semiconductor materials that will provide benefit to society in the form of more efficient, longer life electronics; reduced energy consumption; and improved environmental quality.

这个小型企业创新研究（SBIR）第二阶段项目旨在开发一种独特的热压压铸技术，用于生产石墨金属材料。这些材料将用于生产高功率电子封装中使用的封装组件。迫切需要能够满足当前和未来大功率电子系统的热管理要求的具有改进的热性能的先进材料。由于半导体材料的不断进步、电路物理架构的压缩、封装的尺寸减小以及更快的开关速度，电子系统的散热率急剧增加。该项目中开发的技术将使具有成本效益的石墨金属封装的制造成为可能，该封装提供了对下一代电力电子热管理解决方案至关重要的改进的热性能。该项目更广泛的影响/商业潜力将是开发用于生产石墨金属坯料材料的热压压铸技术。用于电子系统的石墨-金属封装产品的采用和广泛使用将使得基于更高效的更高功率半导体材料的商业电子设备成为可能，这将以更高效、更长寿命的电子设备的形式为社会提供益处;降低能耗;以及改善环境质量。