SBIR Phase I: Development of Manufacturing Processes for High Thermal Conductivity Carbon Skeletal Structures for Use in Metal and Metal Matrix Components

SBIR 第一阶段：开发用于金属和金属基体部件的高导热性碳骨架结构的制造工艺

• 批准号: 0419326
• 负责人: James Connell
• 金额: $ 9.96万
• 依托单位: ADVANCED THERMAL TECHNOLOGIES
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2004
• 资助国家: 美国
• 起止时间: 2004-07-01 至 2004-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0419326&HistoricalAwards=false
• 关键词: SBIR; Phase; Development; Manufacturing; Processes

This Small Business Innovation Research (SBIR) Phase I will develop novel metal and metal matrix composite (MMC) materials that incorporate high thermal conductivity carbon (HTCC) inserts. There is a critical need for advanced materials with improved thermal properties capable of meeting the thermal management requirements of current and future high power electronic systems. The objective of this project is the development of the fundamental basis for the manufacturing processes and procedures required to produce cost-effective HTCC skeletal structure cores. This manufacturing technology would enable cost effective metal-HTCC and MMC-HTCC material systems with a thermal conductivity greater than that of copper and which have a coefficient of thermal expansion that can be adjusted between 6.0 and 10 ppm /degrees C to match that of an electronic package. The heat dissipation rate of electronic systems has increased dramatically as a result of ongoing advances in semiconductor materials, compression of circuit physical architecture, size reduction of packaging envelops and faster switching speed. High power electronics have reached heat flux levels of up to 500 W/cm2 and this level is projected to exceed 1,000 W/cm2 within several years. The results of this project couldl enable the manufacture of HTCC-based materials that achieve the target thermal properties critical to satisfying thermal management solutions for high power applications. The broader impacts that could derive from this project could be in advanced high power military and industrial systems (e.g., phased-array radar systems, high energy laser systems, power control, distribution and management systems), telecommunication base stations and finally high-end computers (e.g., servers, work stations, etc.). The commercial market for these HTCC-based materials will develop over a three to five year period, during which time HTCC-based materials will achieve widespread use in a broad spectrum of military, industrial, and commercial electronic applications driven by the need to reduce system packaging envelop coupled with the need to use more efficient, high temperature semiconductor materials that have higher heat fluxes and higher heat dissipation rates.

该小型企业创新研究（SBIR）第一阶段将开发新型金属和金属基复合材料（MMC），其中包括高导热碳（HTCC）插入物。 迫切需要能够满足当前和未来大功率电子系统的热管理要求的具有改进的热性能的先进材料。 该项目的目标是为生产具有成本效益的HTCC骨架结构芯所需的制造工艺和程序开发基本基础。 这种制造技术将使得具有成本效益的金属-HTCC和MMC-HTCC材料系统具有大于铜的热导率，并且其具有可以在6.0和10 ppm /摄氏度之间调节的热膨胀系数，以匹配电子封装的热膨胀系数。 由于半导体材料的不断进步、电路物理架构的压缩、封装的尺寸减小以及更快的开关速度，电子系统的散热率急剧增加。高功率电子器件已经达到高达500 W/cm 2的热通量水平，并且该水平预计在几年内将超过1，000 W/cm 2。 该项目的结果可以使基于HTCC的材料的制造实现目标热性能，这对于满足高功率应用的热管理解决方案至关重要。 该项目可能产生的更广泛影响可能是先进的高功率军事和工业系统（例如，相控阵雷达系统、高能激光系统、功率控制、分配和管理系统），电信基站以及最后的高端计算机（例如，服务器、工作站等）。 这些基于HTCC的材料的商业市场将在三到五年的时间内发展，在此期间，基于HTCC的材料将在广泛的军事，工业和商业电子应用中实现广泛的使用，这是由于需要减少系统封装外壳，以及需要使用具有更高热通量和更高散热率的更有效的高温半导体材料。