Collaborative Research: SMA: Accurate Temperature Measurement Infrastructure and Methodology for Power, Variability, and Reliability Analysis
Collaborative Research: SMA: Accurate Temperature Measurement Infrastructure and Methodology for Power, Variability, and Reliability Analysis
批准号:
0719790
负责人:
Michael Huang
金额:
$0.0万
依托单位:
依托单位国家:
美国
项目类别:
Continuing Grant
财政年份:
2007
资助国家:
美国
项目状态:
已结题
起止时间:
2007-08-01 至 2010-07-31
中文摘要
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英文摘要
Simulation environments are an indispensable tool in the design, prototyping,performance evaluation, and analysis of computer systems. Simulator must be ableto faithfully reflect the behavior of the system being analyzed. To ensure theaccuracy of the simulator, it must be verified and determined to closely matchempirical data. Modern processors provide enough performance counters tovalidate the majority of the performance models; nevertheless, the informationprovided is not enough to validate power consumption, thermal models, andprocess variability.Temperature and power consumption are first order design parameters for modernhigh performance architectures. High operational temperatures and large powerconsumption present possible limits to performance and manufacturability. Whiletemperature and power are dominant factors on processor design, processvariability is becoming another major constraint.In order to address some of the difficulties associated with the validation ofpower, thermal models, and process variability, we propose to use an infraredmeasurement setup to capture run-time power consumption and thermalcharacteristics of modern chips.A detailed thermal model can use the measured temperatures to generate a powerdetailed power consumption. The same thermal measurements will be used tomeasure process variability from of-the-shelf processors. In addition, theresulting infrastructure will be use to develop a verified thermal simulationinfrastructure and process variability models.
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