TC: Large: Collaborative Research: 3Dsec: Trustworthy System Security through 3-D Integrated Hardware

TC：大型：协作研究：3Dsec：通过 3D 集成硬件实现值得信赖的系统安全

• 批准号: 0910389
• 负责人: Timothy Sherwood
• 金额: $ 43.62万
• 依托单位: University of California-Santa Barbara
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2010
• 资助国家: 美国
• 起止时间: 2010-03-01 至 2014-02-28
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0910389&HistoricalAwards=false
• 关键词: TC; Large; Collaborative; Research; 3Dsec

While hardware resources for computation and data storage are now abundant,economic factors prevent specialized hardware security mechanisms from beingintegrated into commodity parts. System owners are caught between the need to exploitcheap, fast, commodity microprocessors and the need to ensure that critical securityproperties hold.This research will explore a novel way to augment commodity hardware after fabricationto enhance secure operation. The basic approach is to add a separate silicon layer,housing select security features, onto an existing integrated circuit. This 3-D Integrationdecouples the function and economics of security policy enforcement from theunderlying computing hardware. As a result, security enhancements are manufacturingoptions applicable only to those systems that require them, which resolves theeconomic quandary. We plan to identify a minimal and realizable set of circuit-levelsecurity capabilities enabled by this approach, which can be judiciously controlled bythe software layers. This will significantly assist in reducing both the software complexityoften associated with security mechanisms and system vulnerabilities.This research introduces a fundamentally new method to incorporate securitymechanisms into hardware and has the potential to significantly shift the economics oftrustworthy systems. A broader impact will result through collaborative and educationalactivities. Graduate and undergraduate student research associates will transferknowledge to future teachers, researchers and Information Assurance professionals;and project publications will provide direct technical transfer to the embedded-systemsand hardware-design communities.

虽然用于计算和数据存储的硬件资源现在很丰富，但经济因素阻碍了专门的硬件安全机制被集成到商品部件中。系统所有者面临着开发廉价、快速的商用微处理器的需要和确保关键安全属性的需要之间的矛盾。这项研究将探索一种在制造后增强商用硬件以增强安全操作的新方法。基本方法是在现有集成电路上添加一个单独的硅层，以容纳选定的安全功能。这种 3D 集成将安全策略执行的功能和经济性与底层计算硬件解耦。因此，安全增强是制造选项，仅适用于需要它们的系统，从而解决了经济困境。我们计划确定通过这种方法实现的一组最小且可实现的电路级安全功能，这些功能可以由软件层明智地控制。这将显着有助于降低通常与安全机制和系统漏洞相关的软件复杂性。这项研究引入了一种将安全机制整合到硬件中的全新方法，并有可能显着改变可信系统的经济性。通过合作和教育活动将产生更广泛的影响。研究生和本科生研究助理将向未来的教师、研究人员和信息保障专业人员传授知识；项目出版物将为嵌入式系统和硬件设计社区提供直接的技术传授。