Direct-Write Nanomanufacturing of High Density and High Aspect Ratio Metal Electrode Arrays

该项目的目的是开发和应用一种喷嘴阵列，用于放大制造高密度和高深宽比的金属电极阵列。这种发展是基于我们最近引入的半月面受限电沉积原理，并将其应用于直接写入。环境中的各种三维金属微纳结构，包括高深宽比的平面外金属导线、亚微米电互连以及弯曲和卷曲的微/纳米结构。通过扩大制造工艺，拟议的开发将在制造3D微米和纳米尺度金属结构的能力方面实现跨越式发展，这些结构具有前所未有的尺寸和形状控制，所有这些都是在环境环境和直写方式下进行的。所开发的工艺将对微电子行业和器件封装行业具有极大的吸引力，该技术为制造具有微米甚至纳米特征尺寸的三维高密度电互连提供了一种全新的方法，同时显著简化了制造工艺，极大地扩展了设计灵活性，显著减小了尺寸，并最终提供了巨大的成本节约。该项目开发的方法和技术也是吸引学生和公众教育的主题，并将广泛整合到各种教育项目中，以有效地培训下一代劳动力，并教育公众科学进步的好处。

The project is aimed to develop and apply a nozzle array for the scale-up fabrication of high density and high aspect ratio metal electrode arrays. The development is based on a meniscus-confined electrodeposition principle that we have recently introduced and applied in ?direct writing? a variety of 3-D metal micro and nanostructures in an ambient environment, including high aspect ratio out-of-plane metal wires, submicron electrical interconnects, and curved and coiled micro/nanostructures. By scaling up the manufacturing process, the proposed development is positioned to provide a leap-forward advance in capabilities for manufacturing 3-D microscale and nanoscale metal structures with unprecedented dimensional and shape controls, all in an ambient environment and in a direct-write means. The developed processes will be highly attractive to microelectronics industry and device packaging industry where this technology offers a brand new way of fabricating 3-D high density electrical interconnects with microscale and even nanoscale feature sizes while significantly simplifies the fabrication process, greatly expands the design flexibility, considerably reduces the size and ultimately provides great cost savings. The methods and technologies developed in this project are also appealing subjects for the education of students and the public, and will be broadly integrated into various educational programs to effectively train the next generation work force and educate the public the benefit of scientific advancement.