Hybrid Wireless Network-on-Chips

混合无线片上网络

• 批准号: 1232164
• 负责人: Baris Taskin
• 金额: $ 40万
• 依托单位: Drexel University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2012
• 资助国家: 美国
• 起止时间: 2012-09-01 至 2016-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1232164&HistoricalAwards=false
• 关键词: Hybrid; Wireless; Network; Chips

Intellectual Merit: On-chip radio-frequency (RF) wireless communication will be investigated to propose a unified design framework for its applicability on contemporary Multi-Processor System-On-Chips (MPSoCs) in 2D and 3D semiconductor technologies. RF wireless communication will be established with multiple antennas on the same die for a 2D integrated circuit (IC), or multiple antennas and/or couplers on the same 3D IC package. In order to enhance these on-chip wireless communication channels, novel approaches in reconfigurability of wireless interconnects will be utilized, as well as exploring the applicability of various wireless communication schemes of the proposed research is in leveraging the diverse knowledge in wireless communications to improve the MPSoC performance in computing and power efficiency. Performance profiling of proposed communication circuits and channel quality will be examined on a network-on-chip system to observe the direct impact of proposed novelties in MPSoC efficiency, highlighting trade-offs in physical, wireless, channel and communication quality and the MPSoC computing efficiency.Broader Impact: Proposed research will enable the next generation of low-power, increased functionality ICs, as well as providing a high performance interconnect for current and future(i.e. 3D IC, MPSoC) microelectronic devices. Wireless interconnects are a vehicle to alleviate the power wall and communication challenge in contemporary MPSoCs and enabling the further scaling of complementary-metal-oxide-semiconductor technology by replacing the power-hungry wire-based interconnects. Impacts on education include those generated by new course modules developed to integrate in undergraduate-level wireless communications and very large scale integration (VLSI) design courses, a new graduate course, student projects (independent and research experience for undergraduates projects) and outreach to high-school students to promote science, technology, engineering and mathematics disciplines. Investigators are proactively participating in outreach activities to create synergy in VLSI and wireless communities, including a recent newsletter article on wireless interconnects to 3000+ recipients in the VLSI community.

智力优势：将研究片上射频 (RF) 无线通信，以提出一个统一的设计框架，以使其适用于 2D 和 3D 半导体技术中的当代多处理器片上系统 (MPSoC)。 RF 无线通信将通过 2D 集成电路 (IC) 的同一芯片上的多个天线或同一 3D IC 封装上的多个天线和/或耦合器来建立。 为了增强这些片上无线通信通道，将利用无线互连可重构性的新方法，并探索所提出的研究的各种无线通信方案的适用性，以利用无线通信的多样化知识来提高 MPSoC 的计算性能和功率效率。 将在片上网络系统上检查所提议的通信电路和通道质量的性能分析，以观察所提议的新颖性对 MPSoC 效率的直接影响，突出物理、无线、通道和通信质量以及 MPSoC 计算效率的权衡。更广泛的影响：所提议的研究将实现下一代低功耗、增强功能的 IC，并为当前和未来（即 3D）提供高性能互连 IC、MPSoC）微电子器件。 无线互连是一种缓解当代 MPSoC 中的电源墙和通信挑战的工具，并通过取代耗电的有线互连来进一步扩展互补金属氧化物半导体技术。对教育的影响包括为整合本科水平无线通信和超大规模集成（VLSI）设计课程而开发的新课程模块、新的研究生课程、学生项目（本科生项目的独立和研究经验）以及向高中生推广科学、技术、工程和数学学科的影响。 研究人员正在积极参与外展活动，以在 VLSI 和无线社区中创造协同效应，包括最近向 VLSI 社区中的 3000 多名收件人发布的关于无线互连的时事通讯文章。

项目成果

Wireless Network-on-Chip analysis of propagation technique for on-chip communication

片上通信传播技术的无线片上网络分析

• DOI: 10.1109/iccd.2016.7753313
• 发表时间: 2016
• 期刊: 2016 IEEE 34th International Conference on Computer Design (ICCD
• 作者: Pano, Vasil;Yilmaz, Isikcan;Liu, Yuqiao;Taskin, Baris;Dandekar, Kapil
• 通讯作者: Dandekar, Kapil

Wireless NoCs Using Directional and Substrate Propagation Antennas

使用定向天线和基板传播天线的无线 NoC

• DOI: 10.1109/isvlsi.2017.41
• 发表时间: 2017
• 期刊: 2017 IEEE Computer Society Annual Symposium on VLSI (ISVLSI
• 作者: Pano, Vasil;Liu, Yuqiao;Yilmaz, Isikcan;More, Ankit;Taskin, Baris;Dandekar, Kapil
• 通讯作者: Dandekar, Kapil

Innovative propagation mechanism for inter-chip and intra-chip communication

芯片间和芯片内通信的创新传播机制

• DOI: 10.1109/wamicon.2015.7120367
• 发表时间: 2015
• 期刊: WAMICON 2015
• 作者: Liu, Yuqiao;Pano, Vasil;Patron, Damiano;Dandekar, Kapil;Taskin, Baris
• 通讯作者: Taskin, Baris